Steiner; Kurt George
Patent Applications and Registrations
Patent applications and USPTO patent grants for Steiner; Kurt George.The latest application filed is for "inductor formed in an integrated circuit".
- Steiner; Kurt George - Fogelsville PA
- Steiner; Kurt George - Orlando FL
- Steiner; Kurt George - Bethlehem PA
| Patent | Date |
|---|---|
| Inductor formed in an integrated circuit Grant 7,678,639 - Harris , et al. March 16, 2 | 2010-03-16 |
| Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures Grant 7,566,964 - Kang , et al. July 28, 2 | 2009-07-28 |
| Inductor formed in an integrated circuit Grant 7,541,238 - Harris , et al. June 2, 2 | 2009-06-02 |
| Inductor Formed In An Integrated Circuit App 20090100668 - Harris; Edward Belden ; et al. | 2009-04-23 |
| Protruding spacers for self-aligned contacts Grant 7,332,775 - Steiner , et al. February 19, 2 | 2008-02-19 |
| Protruding spacers for self-aligned contacts App 20070023848 - Steiner; Kurt George ; et al. | 2007-02-01 |
| Protruding spacers for self-aligned contacts Grant 7,126,198 - Steiner , et al. October 24, 2 | 2006-10-24 |
| Inductor formed in an integrated circuit App 20060192647 - Harris; Edward Belden ; et al. | 2006-08-31 |
| Inductor formed in an integrated circuit Grant 7,068,139 - Harris , et al. June 27, 2 | 2006-06-27 |
| Mask layer and dual damascene interconnect structure in a semiconductor device Grant 7,067,419 - Huang , et al. June 27, 2 | 2006-06-27 |
| Reinforced bond pad Grant 6,960,836 - Bachman , et al. November 1, 2 | 2005-11-01 |
| Inductor formed in an integrated circuit App 20050099259 - Harris, Edward Belden ; et al. | 2005-05-12 |
| Split barrier layer including nitrogen-containing portion and oxygen-containing portion Grant 6,879,046 - Gibson, Jr. , et al. April 12, 2 | 2005-04-12 |
| Methods and system for reinforcing a bond pad App 20050067709 - Bachman, Mark Adam ; et al. | 2005-03-31 |
| Copper silicide passivation for improved reliability Grant 6,869,873 - Bradshaw , et al. March 22, 2 | 2005-03-22 |
| Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures App 20040201101 - Kang, Seung H. ; et al. | 2004-10-14 |
| Copper silicide passivation for improved reliability App 20040097075 - Bradshaw, Robert Wayne ; et al. | 2004-05-20 |
| Protruding spacers for self-aligned contacts App 20040043574 - Steiner, Kurt George ; et al. | 2004-03-04 |
| Split barrier layer including nitrogen-containing portion and oxygen-containing portion App 20030003765 - Gibson, Gerald W. JR. ; et al. | 2003-01-02 |
| Clustered system and method for formation of integrated circuit devices App 20010012667 - Ma, Yi ; et al. | 2001-08-09 |
| Integrated circuit dielectric formation Grant 6,140,222 - Bollinger , et al. October 31, 2 | 2000-10-31 |
| Transistor fabrication method Grant 5,891,784 - Cheung , et al. April 6, 1 | 1999-04-06 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 