Steigerwald; Daniel Alexander

Patent Applications and Registrations

Patent applications and USPTO patent grants for Steigerwald; Daniel Alexander.The latest application filed is for "led having vertical contacts redistributed for flip chip mounting".

Company Profile

1.15.16

Steigerwald; Daniel Alexander - San Jose CA
Steigerwald; Daniel Alexander - Cupertino CA
Steigerwald; Daniel Alexander - Eindhoven NL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
P--N separation metal fill for flip chip LEDs Grant 10,170,675 - Lei , et al. J	2019-01-01
Method of processing a semiconductor structure Grant 10,056,531 - Bhat , et al. August 21, 2	2018-08-21
Led Having Vertical Contacts Redistributed For Flip Chip Mounting App 20180019370 - Lei; Jipu ; et al.	2018-01-18
P-n Separation Metal Fill For Flip Chip Leds App 20170373235 - Lei; Jipu ; et al.	2017-12-28
LED having vertical contacts redistributed for flip chip mounting Grant 9,722,137 - Lei , et al. August 1, 2	2017-08-01
Method of attaching a light emitting device to a support substrate Grant 9,705,047 - Steigerwald , et al. July 11, 2	2017-07-11
Method of attaching a light emitting device to a support substrate Grant 9,431,581 - Steigerwald , et al. August 30, 2	2016-08-30
Method Of Attaching A Light Emitting Device To A Support Substrate App 20160197244 - STEIGERWALD; DANIEL ALEXANDER ; et al.	2016-07-07
Led Having Vertical Contacts Redistributed For Flip Chip Mounting App 20160126408 - Lei; Jipu ; et al.	2016-05-05
P-n Separation Metal Fill For Flip Chip Leds App 20160126436 - Lei; Jipu ; et al.	2016-05-05
Method Of Attaching A Light Emitting Device To A Support Substrate App 20160020198 - STEIGERWALD; DANIEL ALEXANDER ; et al.	2016-01-21
P-N separation metal fill for flip chip LEDs Grant 9,219,209 - Lei , et al. December 22, 2	2015-12-22
Method of attaching a light emitting device to a support substrate Grant 9,153,758 - Steigerwald , et al. October 6, 2	2015-10-06
Light emitting device chip scale package Grant 8,951,817 - Steigerwald February 10, 2	2015-02-10
Method Of Processing A Semiconductor Structure App 20140179029 - Bhat; Jerome Chandra ; et al.	2014-06-26
Light Emitting Device Bonded To A Support Substrate App 20140077246 - Bhat; Jerome Chandra ; et al.	2014-03-20
P-n Separation Metal Fill For Flip Chip Leds App 20140061714 - Lei; Jipu ; et al.	2014-03-06
Light Emitting Device Chip Scale Package App 20130292716 - Steigerwald; Daniel Alexander	2013-11-07
Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa Grant 6,630,689 - Bhat , et al. October 7, 2	2003-10-07
Monolithic series/parallel led arrays formed on highly resistive substrates Grant 6,547,249 - Collins, III , et al. April 15, 2	2003-04-15
Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa App 20030025212 - Bhat, Jerome Chandra ; et al.	2003-02-06
Monolithic series/parallel led arrays formed on highly resistive substrates App 20020139987 - Collins, William David III ; et al.	2002-10-03
Semiconductor LED flip-chip having low refractive index underfill Grant 6,455,878 - Bhat , et al. September 24, 2	2002-09-24

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