Patent | Date |
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Wafer level method for manufacturing integrated infrared (IR) emitter elements having an optical IR filter placed on the main surface region of the carrier substrate on which the IR emitter is formed Grant 11,402,556 - Pindl , et al. August 2, 2 | 2022-08-02 |
Die stack arrangement comprising a die-attach-film tape and method for producing same Grant 11,342,298 - Steiert , et al. May 24, 2 | 2022-05-24 |
Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method for Producing Same App 20210005568 - Steiert; Matthias ;   et al. | 2021-01-07 |
Die stack arrangement comprising a die-attach-film tape and method for producing same Grant 10,861,818 - Steiert , et al. December 8, 2 | 2020-12-08 |
Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly Grant 10,793,429 - Steiert , et al. October 6, 2 | 2020-10-06 |
Method for Manufacturing Integrated Emitter Elements Having an Optical Filter App 20200249380 - Kind Code | 2020-08-06 |
Method For Producing Packaged Mems Assemblies At The Wafer Level, And Packaged Mems Assembly App 20200156933 - Steiert; Matthias ;   et al. | 2020-05-21 |
MEMS sound transducer element and method for producing a MEMS sound transducer element Grant 10,616,703 - Steiert , et al. | 2020-04-07 |
Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly Grant 10,584,028 - Steiert , et al. | 2020-03-10 |
Semiconductor package with a through port for sensor applications Grant 10,549,985 - Maier , et al. Fe | 2020-02-04 |
Method for producing a MEMS sensor, and MEMS sensor Grant 10,486,961 - Steiert Nov | 2019-11-26 |
Die Stack Arrangement And Method For Producing Same App 20190304945 - Steiert; Matthias ;   et al. | 2019-10-03 |
Camptothecin derivatives and uses thereof Grant 10,407,437 - Langecker , et al. Sept | 2019-09-10 |
Apparatus with a high heat capacity and method for producing the same Grant 10,377,626 - Goller , et al. A | 2019-08-13 |
Method For Producing A Mems Sensor, And Mems Sensor App 20190055117 - Steiert; Matthias | 2019-02-21 |
Composite Nanoparticles And Uses Thereof App 20180369232 - Langecker; Peter ;   et al. | 2018-12-27 |
Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening Grant 10,155,657 - Steiert , et al. Dec | 2018-12-18 |
Method For Producing Packaged Mems Assemblies At The Wafer Level, And Packaged Mems Assembly App 20180327258 - Steiert; Matthias ;   et al. | 2018-11-15 |
Apparatus With A High Heat Capacity And Method For Producing The Same App 20180305200 - Goller; Bernd ;   et al. | 2018-10-25 |
Mems Sound Transducer Element And Method For Producing A Mems Sound Transducer Element App 20180295458 - Steiert; Matthias ;   et al. | 2018-10-11 |
Composite nanoparticles and uses thereof Grant 10,064,855 - Langecker , et al. September 4, 2 | 2018-09-04 |
Semiconductor Package with a Through Port for Sensor Applications and Methods of Manufacture App 20180148322 - Maier; Dominic ;   et al. | 2018-05-31 |
Camptothecin Derivatives And Uses Thereof App 20170260194 - Langecker; Peter ;   et al. | 2017-09-14 |
Composite Nanoparticles And Uses Thereof App 20170258785 - Langecker; Peter ;   et al. | 2017-09-14 |
Electronic Sensor Device Including A Flip-chip Mounted Semiconductor Chip And A Substrate With An Opening App 20170081175 - Steiert; Matthias ;   et al. | 2017-03-23 |
Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device Grant 9,475,691 - Chua , et al. October 25, 2 | 2016-10-25 |
Liquid analysis using capacitative micromachined ultrasound transducers Grant 8,733,154 - Cable , et al. May 27, 2 | 2014-05-27 |
Liquid Analysis Using Capacitative Micromachined Ultrasound Transducers App 20130205878 - CABLE; Michael D. ;   et al. | 2013-08-15 |
Liquid analysis using capacitative micromachined ultrasound transducers Grant 8,424,370 - Cable , et al. April 23, 2 | 2013-04-23 |
Liquid Analysis Using Capacitative Micromachined Ultrasound Transducers App 20100180673 - CABLE; Michael D. ;   et al. | 2010-07-22 |