loadpatents
name:-0.029375076293945
name:-0.057129859924316
name:-0.012933015823364
Steiert; Matthias Patent Filings

Steiert; Matthias

Patent Applications and Registrations

Patent applications and USPTO patent grants for Steiert; Matthias.The latest application filed is for "die stack arrangement comprising a die-attach-film tape and method for producing same".

Company Profile
12.16.15
  • Steiert; Matthias - Ehrenkirchen DE
  • Steiert; Matthias - Rosenheim DE
  • Steiert; Matthias - San Leandro CA
  • Steiert; Matthias - Albany CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wafer level method for manufacturing integrated infrared (IR) emitter elements having an optical IR filter placed on the main surface region of the carrier substrate on which the IR emitter is formed
Grant 11,402,556 - Pindl , et al. August 2, 2
2022-08-02
Die stack arrangement comprising a die-attach-film tape and method for producing same
Grant 11,342,298 - Steiert , et al. May 24, 2
2022-05-24
Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method for Producing Same
App 20210005568 - Steiert; Matthias ;   et al.
2021-01-07
Die stack arrangement comprising a die-attach-film tape and method for producing same
Grant 10,861,818 - Steiert , et al. December 8, 2
2020-12-08
Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly
Grant 10,793,429 - Steiert , et al. October 6, 2
2020-10-06
Method for Manufacturing Integrated Emitter Elements Having an Optical Filter
App 20200249380 - Kind Code
2020-08-06
Method For Producing Packaged Mems Assemblies At The Wafer Level, And Packaged Mems Assembly
App 20200156933 - Steiert; Matthias ;   et al.
2020-05-21
MEMS sound transducer element and method for producing a MEMS sound transducer element
Grant 10,616,703 - Steiert , et al.
2020-04-07
Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly
Grant 10,584,028 - Steiert , et al.
2020-03-10
Semiconductor package with a through port for sensor applications
Grant 10,549,985 - Maier , et al. Fe
2020-02-04
Method for producing a MEMS sensor, and MEMS sensor
Grant 10,486,961 - Steiert Nov
2019-11-26
Die Stack Arrangement And Method For Producing Same
App 20190304945 - Steiert; Matthias ;   et al.
2019-10-03
Camptothecin derivatives and uses thereof
Grant 10,407,437 - Langecker , et al. Sept
2019-09-10
Apparatus with a high heat capacity and method for producing the same
Grant 10,377,626 - Goller , et al. A
2019-08-13
Method For Producing A Mems Sensor, And Mems Sensor
App 20190055117 - Steiert; Matthias
2019-02-21
Composite Nanoparticles And Uses Thereof
App 20180369232 - Langecker; Peter ;   et al.
2018-12-27
Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening
Grant 10,155,657 - Steiert , et al. Dec
2018-12-18
Method For Producing Packaged Mems Assemblies At The Wafer Level, And Packaged Mems Assembly
App 20180327258 - Steiert; Matthias ;   et al.
2018-11-15
Apparatus With A High Heat Capacity And Method For Producing The Same
App 20180305200 - Goller; Bernd ;   et al.
2018-10-25
Mems Sound Transducer Element And Method For Producing A Mems Sound Transducer Element
App 20180295458 - Steiert; Matthias ;   et al.
2018-10-11
Composite nanoparticles and uses thereof
Grant 10,064,855 - Langecker , et al. September 4, 2
2018-09-04
Semiconductor Package with a Through Port for Sensor Applications and Methods of Manufacture
App 20180148322 - Maier; Dominic ;   et al.
2018-05-31
Camptothecin Derivatives And Uses Thereof
App 20170260194 - Langecker; Peter ;   et al.
2017-09-14
Composite Nanoparticles And Uses Thereof
App 20170258785 - Langecker; Peter ;   et al.
2017-09-14
Electronic Sensor Device Including A Flip-chip Mounted Semiconductor Chip And A Substrate With An Opening
App 20170081175 - Steiert; Matthias ;   et al.
2017-03-23
Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
Grant 9,475,691 - Chua , et al. October 25, 2
2016-10-25
Liquid analysis using capacitative micromachined ultrasound transducers
Grant 8,733,154 - Cable , et al. May 27, 2
2014-05-27
Liquid Analysis Using Capacitative Micromachined Ultrasound Transducers
App 20130205878 - CABLE; Michael D. ;   et al.
2013-08-15
Liquid analysis using capacitative micromachined ultrasound transducers
Grant 8,424,370 - Cable , et al. April 23, 2
2013-04-23
Liquid Analysis Using Capacitative Micromachined Ultrasound Transducers
App 20100180673 - CABLE; Michael D. ;   et al.
2010-07-22
Company Registrations

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