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Patent applications and USPTO patent grants for Steffl; Thomas.The latest application filed is for "cable and polymer composition comprising a multimodal ethylene copolymer".
Patent | Date |
---|---|
Copolymer composition for semiconductive cable layer Grant 10,308,794 - Steffl , et al. | 2019-06-04 |
Method of producing a cable comprising a multimodal ethylene copolymer Grant 10,087,296 - Ek , et al. October 2, 2 | 2018-10-02 |
Polymer composition for electrical devices Grant 9,978,476 - Andersson , et al. May 22, 2 | 2018-05-22 |
Polymer composition for electrical devices Grant 9,978,478 - Andersson , et al. May 22, 2 | 2018-05-22 |
Cable with semiconductive layer made of polypropylene composition and improved long term thermal stability Grant 9,852,826 - Steffl , et al. December 26, 2 | 2017-12-26 |
Cable And Polymer Composition Comprising A Multimodal Ethylene Copolymer App 20160060411 - EK; CARL-GUSTAV ;   et al. | 2016-03-03 |
Cable and polymer composition Grant 8,907,218 - Steffl , et al. December 9, 2 | 2014-12-09 |
Polymer Composition for Electrical Devices App 20140093732 - Andersson; Johan ;   et al. | 2014-04-03 |
Polymer Composition for Electrical Devices App 20140069689 - Andersson; Johan ;   et al. | 2014-03-13 |
New Composition And Use Thereof App 20130161059 - Steffl; Thomas ;   et al. | 2013-06-27 |
New Composition And Use Thereof App 20130133922 - Steffl; Thomas ;   et al. | 2013-05-30 |
Cable layer of modified soft polypropylene with improved stress whitening resistance Grant 8,450,421 - Pham , et al. May 28, 2 | 2013-05-28 |
Cable And Polymer Composition App 20120325515 - Steffl; Thomas ;   et al. | 2012-12-27 |
Cable And Polymer Composition Comprising A Multimodal Ethylene Copolymer App 20110290529 - Pakkanen; Anneli ;   et al. | 2011-12-01 |
Cable Layer Of Modified Soft Polypropylene With Improved Stress Whitening Resistance App 20110266027 - Pham; Tung ;   et al. | 2011-11-03 |
Cable And Polymer Composition Comprising A Multimodal Ethylene Copolymer App 20110253418 - Ek; Carl-Gustav ;   et al. | 2011-10-20 |
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