Steffen; Francis
Patent Applications and Registrations
Patent applications and USPTO patent grants for Steffen; Francis.The latest application filed is for "perforated electronic package and method of fabrication".
- Steffen; Francis - Saint Maximin FR
- Steffen; Francis - St. Maximin FR
- Steffen; Francis - Rousset FR
- Steffen; Francis - Aix Les Bains FR
| Patent | Date |
|---|---|
| Tear-proof circuit Grant 9,226,393 - Steffen , et al. December 29, 2 | 2015-12-29 |
| Perforated electronic package and method of fabrication Grant 9,196,590 - Steffen , et al. November 24, 2 | 2015-11-24 |
| Perforated Electronic Package And Method Of Fabrication App 20150262941 - Steffen; Francis ; et al. | 2015-09-17 |
| Tear-proof Circuit App 20150029275 - Steffen; Francis ; et al. | 2015-01-29 |
| Tear-proof circuit Grant 8,867,217 - Steffen , et al. October 21, 2 | 2014-10-21 |
| Tear-proof Circuit App 20100194645 - Steffen; Francis ; et al. | 2010-08-05 |
| Method for connecting a semiconductor chip onto an interconnection support App 20060270110 - Steffen; Francis | 2006-11-30 |
| Micromodule, particularly for chip card App 20060261456 - Steffen; Francis | 2006-11-23 |
| Process for manufacturing a chip card micromodule with protection barriers Grant 6,071,758 - Steffen June 6, 2 | 2000-06-06 |
| Chip card system provided with an offset electronic circuit Grant 5,574,270 - Steffen November 12, 1 | 1996-11-12 |
| Smart card chip-based electronic circuit Grant 5,311,396 - Steffen May 10, 1 | 1994-05-10 |
| Encapsulation of electronic modules Grant 5,147,982 - Steffen September 15, 1 | 1992-09-15 |
| Housing for containing a fragile element such as a logic circuit Grant 5,107,073 - Steffen April 21, 1 | 1992-04-21 |
| Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip Grant 5,041,395 - Steffen August 20, 1 | 1991-08-20 |
| Method for the encapsulation of integrated circuits Grant 4,857,483 - Steffen , et al. August 15, 1 | 1989-08-15 |
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