| Patent | Date |
|---|
Oil filled transducers with isolated compensating capsule
Grant 11,359,985 - Ned , et al. June 14, 2 | 2022-06-14 |
Oil Filled Transducers With Isolated Compensating Capsule
App 20210048363 - Ned; Alexander A. ; et al. | 2021-02-18 |
High Temperature Protected Wire Bonded Sensors
App 20210041318 - Ned; Alexander A. ; et al. | 2021-02-11 |
High temperature protected wire bonded sensors
Grant 10,871,415 - Ned , et al. December 22, 2 | 2020-12-22 |
Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding
Grant 10,825,719 - Ned , et al. November 3, 2 | 2020-11-03 |
High-temperature headers for sensing elements
Grant 10,605,685 - Ned , et al. | 2020-03-31 |
High Temperature Protected Wire Bonded Sensors
App 20200011757 - Ned; Alexander A. ; et al. | 2020-01-09 |
High temperature protected wire bonded sensors
Grant 10,436,662 - Ned , et al. O | 2019-10-08 |
Methods Of Fabricating Silicon-on-insulator (soi) Semiconductor Devices Using Blanket Fusion Bonding
App 20190237358 - Ned; Alexander A. ; et al. | 2019-08-01 |
Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding
Grant 10,256,138 - Ned , et al. | 2019-04-09 |
High Temperature Protected Wire Bonded Sensors
App 20190041288 - Ned; Alexander A. ; et al. | 2019-02-07 |
High-temperature Headers For Sensing Elements
App 20190033155 - Ned; Alexander ; et al. | 2019-01-31 |
Electronic device interconnections for high temperature operability
Grant 10,153,242 - Stefanescu Dec | 2018-12-11 |
Low-stress floating-chip pressure sensors
Grant 10,132,705 - Stefanescu , et al. November 20, 2 | 2018-11-20 |
High-temperature headers with ribbed components for stress-relieved hermetic sealing
Grant 10,126,195 - Ned , et al. November 13, 2 | 2018-11-13 |
High-temperature headers for sensing elements
Grant 10,119,877 - Ned , et al. November 6, 2 | 2018-11-06 |
Electronic Device Interconnections For High Temperature Operability
App 20180218988 - Stefanescu; Sorin | 2018-08-02 |
Electronic device interconnections for high temperature operability
Grant 9,917,067 - Stefanescu March 13, 2 | 2018-03-13 |
Low-stress Floating-chip Pressure Sensors
App 20180024020 - Stefanescu; Sorin ; et al. | 2018-01-25 |
Methods Of Fabricating Silicon-on-insulator (soi) Semiconductor Devices Using Blanket Fusion Bonding
App 20170330792 - Ned; Alexander A. ; et al. | 2017-11-16 |
Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding
Grant 9,721,832 - Ned , et al. August 1, 2 | 2017-08-01 |
High-temperature Headers For Sensing Elements
App 20170016791 - Ned; Alexander ; et al. | 2017-01-19 |
High-temperature Headers With Ribbed Components For Stress-relieved Hermetic Sealing
App 20170016788 - Ned; Alexander A. ; et al. | 2017-01-19 |
Sensor co-located with an electronic circuit
Grant 9,322,730 - Ned , et al. April 26, 2 | 2016-04-26 |
Sensor Co-located With An Electronic Circuit
App 20160041053 - Ned; Alexander A. ; et al. | 2016-02-11 |
Methods Of Fabricating Silicon-on-insulator (soi) Semiconductor Devices Using Blanket Fusion Bonding
App 20140273399 - NED; ALEXANDER ; et al. | 2014-09-18 |
Differential temperature and acceleration compensated pressure transducer
Grant 8,631,707 - Kurtz , et al. January 21, 2 | 2014-01-21 |
Differential Temperature And Acceleration Compensated Pressure Transducer
App 20110239772 - Kurtz; Anthony D. ; et al. | 2011-10-06 |
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