Stefanescu; Anca
Patent Applications and Registrations
Patent applications and USPTO patent grants for Stefanescu; Anca.The latest application filed is for "systems and methods for ultrasonically cleaving a bonded wafer pair".
- Stefanescu; Anca - St. Charles MO
- Stefanescu; Anca - O'Fallon MO
| Patent | Date |
|---|---|
| Systems And Methods For Ultrasonically Cleaving A Bonded Wafer Pair App 20150126017 - Stefanescu; Anca | 2015-05-07 |
| Methods for in-situ passivation of silicon-on-insulator wafers Grant 8,859,393 - Ries , et al. October 14, 2 | 2014-10-14 |
| Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair App 20120247686 - Stefanescu; Anca | 2012-10-04 |
| Methods For In-Situ Passivation Of Silicon-On-Insulator Wafers App 20120003814 - Ries; Michael J. ; et al. | 2012-01-05 |
| Method for the detection of processing-induced defects in a silicon wafer Grant 6,600,557 - Stefanescu , et al. July 29, 2 | 2003-07-29 |
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