Trademark applications and grants for Stats Chippac Inc. Stats Chippac Inc has 9 trademark applications. The latest application filed is for "STATSCHIPPAC"
Patent Application | Date |
---|---|
Fusible I/O Interconnection Systems and Methods for Flip-Chip Packaging Involving Substrate-Mounted Stud Bumps 20100178735 - 12/731354 Pendse; Rajendra D. | 2010-07-15 |
Fusible I/O Interconnection Systems and Methods for Flip-Chip Packaging Involving Substrate-Mounted Stud Bumps 20100176510 - 12/731330 Pendse; Rajendra D. | 2010-07-15 |
LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY 20090263937 - 12/474131 Ramakrishna; Kambhampati ;   et al. | 2009-10-22 |
SEMICONDUCTOR PACKAGES 20080296759 - 11/757869 Ramakrishna; Kambhampati ;   et al. | 2008-12-04 |
SEMICONDUCTOR PACKAGE SYSTEM WITH DIE CARRIER HAVING MOLD FLOW RESTRICTING ELEMENTS 20080164618 - 11/620553 Chow; Seng Guan ;   et al. | 2008-07-10 |
SEC | 0001093779 | STATS CHIPPAC, INC. of CALIFORNIA |
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