START; Paul R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for START; Paul R..The latest application filed is for "embedded bridge with through-silicon vias".

Company Profile

2.9.15

START; Paul R. - Chandler AZ
Start; Paul R - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Embedded Bridge With Through-silicon Vias App 20210272881 - VAIDYA; Aditya S. ; et al.	2021-09-02
Embedded bridge with through-silicon Vias Grant 11,049,798 - Vaidya , et al. June 29, 2	2021-06-29
Wafer Level Passive Heat Spreader Interposer To Enable Improved Thermal Solution For Stacked Dies In Multi-chips Package And Warpage Control App 20210057381 - BRUN; Xavier F. ; et al.	2021-02-25
Embedded Bridge With Through-silicon Vias App 20190326198 - Vaidya; Aditya S. ; et al.	2019-10-24
Embedded bridge with through-silicon vias Grant 10,373,893 - Vaidya , et al.	2019-08-06
Swaging Process For Complex Integrated Heat Spreaders App 20190043778 - TANG; Zhizhong ; et al.	2019-02-07
Embedded Bridge With Through-silicon Vias App 20190006264 - Vaidya; Aditya S. ; et al.	2019-01-03
Methods of forming ultra thin package structures including low temperature solder and structures formed therby Grant 9,461,014 - Srinivasan , et al. October 4, 2	2016-10-04
Methods Of Forming Ultra Thin Package Structures Including Low Temperature Solder And Structures Formed Therby App 20150221609 - Srinivasan; Sriram ; et al.	2015-08-06
Methods of forming ultra thin package structures including low temperature solder and structures formed therby Grant 9,064,971 - Srinivasan , et al. June 23, 2	2015-06-23
Molded heat spreaders Grant 8,866,290 - Tang , et al. October 21, 2	2014-10-21
Molded Heat Spreaders App 20140264821 - Tang; Zhizhong ; et al.	2014-09-18
Microelectronic Package Including An Encapsulated Heat Spreader App 20140239479 - Start; Paul R	2014-08-28
Methods Of Forming Ultra Thin Package Structures Including Low Temperature Solder And Structures Formed Therby App 20140175644 - Srinivasan; Sriram ; et al.	2014-06-26
In-situ foam material as integrated heat spreader (IHS) sealant Grant 8,703,536 - Start , et al. April 22, 2	2014-04-22
In-situ Foam Material As Integrated Heat Spreader (ihs) Sealant App 20140024176 - Start; Paul R. ; et al.	2014-01-23
In-situ foam materials as integrated heat spreader (IHS) sealant Grant 8,508,040 - Start , et al. August 13, 2	2013-08-13
In-situ Foam Material As Integrated Heat Spreader (ihs) Sealant App 20120139093 - Start; Paul R. ; et al.	2012-06-07

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