loadpatents
name:-0.0071890354156494
name:-0.0044000148773193
name:-0.00062894821166992
STAROSVETSKY; David Patent Filings

STAROSVETSKY; David

Patent Applications and Registrations

Patent applications and USPTO patent grants for STAROSVETSKY; David.The latest application filed is for "carbon-nanotubes copper composite conductors".

Company Profile
0.3.6
  • STAROSVETSKY; David - Haifa IL
  • Starosvetsky; David - Yokneam Ilit IL
  • Starosvetsky; David - Yokneam IL
  • Starosvetsky, David - Yokneam IIit IL
  • Starosvetsky; David - Yokneam Elit IL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Carbon-nanotubes Copper Composite Conductors
App 20220223314 - EIN-ELI; Yair ;   et al.
2022-07-14
Process For Electroplating Of Copper
App 20120028073 - Ein-Eli; Yair ;   et al.
2012-02-02
Copper CMP slurry composition
Grant 7,964,005 - Ein-Eli , et al. June 21, 2
2011-06-21
Method for electrochemical etching of semiconductor material using positive potential dissolution (PPD) in solutions free from hydrogen fluoride (HF)
Grant 7,494,936 - Ein-Eli , et al. February 24, 2
2009-02-24
Copper cmp slurry composition
App 20070163677 - Ein-Eli; Yair ;   et al.
2007-07-19
Method for electrochemical etching of semiconductor material using positive potential dissolution (PPD) in HF-free solutions
App 20060254928 - Ein-Eli; Yair ;   et al.
2006-11-16
Texturing a semiconductor material using negative potential dissolution (NPD)
App 20050148198 - Ein-Eli, Yair ;   et al.
2005-07-07
Anode assembly and method of reducing sludge formation during electroplating
Grant 6,830,673 - Yahalom , et al. December 14, 2
2004-12-14
Anode assembly and method of reducing sludge formation during electroplating
App 20030150715 - Yahalom, Joseph ;   et al.
2003-08-14

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