| Patent | Date |
|---|
Hybrid microelectronic substrate and methods for fabricating the same
Grant 11,444,033 - Starkston , et al. September 13, 2 | 2022-09-13 |
Hybrid Microelectronic Substrates
App 20210384094 - Starkston; Robert ; et al. | 2021-12-09 |
Hybrid microelectronic substrates
Grant 11,114,353 - Starkston , et al. September 7, 2 | 2021-09-07 |
System And Method For Stacking Wire-bond Converted Flip-chip Die
App 20210202441 - GOH; ENG HUAT ; et al. | 2021-07-01 |
Coupling a magnet with a MEMS device
Grant 11,022,792 - Yazzie , et al. June 1, 2 | 2021-06-01 |
Localized High Density Substrate Routing
App 20200395297 - STARKSTON; Robert ; et al. | 2020-12-17 |
Hybrid Microelectronic Substrate And Methods For Fabricating The Same
App 20200335444 - Starkston; Robert ; et al. | 2020-10-22 |
Localized high density substrate routing
Grant 10,796,988 - Starkston , et al. October 6, 2 | 2020-10-06 |
Hybrid microelectronic substrate and methods for fabricating the same
Grant 10,763,215 - Starkston , et al. Sep | 2020-09-01 |
Hybrid microelectronic substrate and methods for fabricating the same
Grant 10,716,214 - Starkston , et al. | 2020-07-14 |
Coupling A Magnet With A Mems Device
App 20190391386 - Yazzie; Kyle ; et al. | 2019-12-26 |
Localized high density substrate routing
Grant 10,366,951 - Starkston , et al. July 30, 2 | 2019-07-30 |
Multi-die package
Grant 10,304,769 - Sankman , et al. | 2019-05-28 |
Hybrid Microelectronic Substrate And Methods For Fabricating The Same
App 20190057937 - Starkston; Robert ; et al. | 2019-02-21 |
Hybrid Microelectronic Substrates
App 20190057915 - Starkston; Robert ; et al. | 2019-02-21 |
Localized High Density Substrate Routing
App 20180350737 - Starkston; Robert ; et al. | 2018-12-06 |
A Hybrid Microelectronic Substrate And Methods For Fabricating The Same
App 20180343744 - Starkston; Robert ; et al. | 2018-11-29 |
Microelectromechanical system with spring for magnet placement
Grant 10,125,013 - Starkston , et al. November 13, 2 | 2018-11-13 |
Multi-die Package
App 20180226334 - SANKMAN; ROBERT L. ; et al. | 2018-08-09 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Grant 10,008,452 - Ma , et al. June 26, 2 | 2018-06-26 |
Microelectromechanical System With Spring For Magnet Placement
App 20180134547 - Starkston; Robert ; et al. | 2018-05-17 |
Panel level fabrication of package substrates with integrated stiffeners
Grant 9,832,860 - Starkston , et al. November 28, 2 | 2017-11-28 |
Localized High Density Substrate Routing
App 20170287831 - Starkston; Robert ; et al. | 2017-10-05 |
Microelectronic Structures Having Laminated Or Embedded Glass Routing Structures For High Density Packaging
App 20170200677 - Ma; Qing ; et al. | 2017-07-13 |
Localized high density substrate routing
Grant 9,679,843 - Starkston , et al. June 13, 2 | 2017-06-13 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Grant 9,642,248 - Ma , et al. May 2, 2 | 2017-05-02 |
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks
App 20160268213 - JIANG; Hongjin ; et al. | 2016-09-15 |
Localized High Density Substrate Routing
App 20160197037 - Starkston; Robert ; et al. | 2016-07-07 |
Panel Level Fabrication Of Package Substrates With Integrated Stiffeners
App 20160095209 - STARKSTON; Robert ; et al. | 2016-03-31 |
Localized high density substrate routing
Grant 9,269,701 - Starkston , et al. February 23, 2 | 2016-02-23 |
Localized High Density Substrate Routing
App 20150340353 - Starkston; Robert ; et al. | 2015-11-26 |
Localized high density substrate routing
Grant 9,136,236 - Starkston , et al. September 15, 2 | 2015-09-15 |
Microelectronic Structures Having Laminated Or Embedded Glass Routing Structures For High Density Packaging
App 20150156869 - Ma; Qing ; et al. | 2015-06-04 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Grant 9,001,520 - Ma , et al. April 7, 2 | 2015-04-07 |
Localized High Density Substrate Routing
App 20140091474 - Starkston; Robert ; et al. | 2014-04-03 |
Microelectronic Structures Having Laminated Or Embedded Glass Routing Structures For High Density Packaging
App 20140085846 - Ma; Qing ; et al. | 2014-03-27 |
Methods and apparatus for laser scribing wafers
Grant 8,364,304 - Starkston , et al. January 29, 2 | 2013-01-29 |
Methods And Apparatus For Laser Scribing Wafers
App 20100279490 - Starkston; Robert ; et al. | 2010-11-04 |
Methods for laser scribing wafers
Grant 7,772,090 - Starkston , et al. August 10, 2 | 2010-08-10 |
Soldering a die to a substrate
Grant 7,332,423 - Starkston , et al. February 19, 2 | 2008-02-19 |
Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
Grant 7,223,638 - Starkston May 29, 2 | 2007-05-29 |
Soldering a die to a substrate
App 20070001318 - Starkston; Robert ; et al. | 2007-01-04 |
Marking on underfill
Grant 7,015,592 - Starkston , et al. March 21, 2 | 2006-03-21 |
Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
App 20050255635 - Starkston, Robert | 2005-11-17 |
Marking on underfill
App 20050206017 - Starkston, Robert ; et al. | 2005-09-22 |
Methods for laser scribing wafers
App 20050067391 - Starkston, Robert ; et al. | 2005-03-31 |
Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material
Grant 6,617,683 - Lebonheur , et al. September 9, 2 | 2003-09-09 |
Method of improving thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material
App 20030067069 - Lebonheur, Vassoudevane ; et al. | 2003-04-10 |
Substrate for reducing electromagnetic interference and enclosure
Grant 6,191,475 - Skinner , et al. February 20, 2 | 2001-02-20 |
EMI containment for microprocessor core mounted on a card using surface mounted clips
Grant 6,043,983 - Taylor , et al. March 28, 2 | 2000-03-28 |
Thermal interface thickness control for a microprocessor
Grant 6,043,560 - Haley , et al. March 28, 2 | 2000-03-28 |
Composition for removing sulfides from industrial gas
Grant 4,647,397 - Starkston , et al. March 3, 1 | 1987-03-03 |
Method for removing sulfides from industrial gas
Grant 4,539,189 - Starkston , et al. September 3, 1 | 1985-09-03 |
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