loadpatents
Patent applications and USPTO patent grants for STARK; Leslie Edward.The latest application filed is for "sensor package cavities with polymer films".
Patent | Date |
---|---|
Sensor Package Cavities With Polymer Films App 20220199479 - KODURI; Sreenivasan Kalyani ;   et al. | 2022-06-23 |
Proximity Sensor App 20220189912 - KODURI; Sreenivasan Kalyani ;   et al. | 2022-06-16 |
Covers For Semiconductor Package Components App 20220181223 - KODURI; Sreenivasan Kalyani ;   et al. | 2022-06-09 |
Film Covers For Sensor Packages App 20220181224 - KODURI; Sreenivasan Kalyani ;   et al. | 2022-06-09 |
Optical Sensor Packages With Glass Members App 20220173256 - KODURI; Sreenivasan Kalyani ;   et al. | 2022-06-02 |
Miniature Sensor Cavities App 20220155109 - KODURI; Sreenivasan Kalyani ;   et al. | 2022-05-19 |
Discrete device mounted on substrate Grant 9,899,339 - Romig , et al. February 20, 2 | 2018-02-20 |
Integrated circuit package with printed circuit layer Grant 9,111,845 - Romig , et al. August 18, 2 | 2015-08-18 |
Electronic assembly with three dimensional inkjet printed traces Grant 8,945,986 - Romig , et al. February 3, 2 | 2015-02-03 |
Integrated Circuit Package With Printed Circuit Layer App 20140361402 - Romig; Matthew David ;   et al. | 2014-12-11 |
Integrated circuit package with printed circuit layer Grant 8,847,349 - Romig , et al. September 30, 2 | 2014-09-30 |
Electronic assembly with three dimensional inkjet printed traces Grant 8,816,513 - Romig , et al. August 26, 2 | 2014-08-26 |
Integrated Circuit Package With Printed Circuit Layer App 20140175599 - Romig; Matthew David ;   et al. | 2014-06-26 |
Discrete Device Mounted On Substrate App 20140124939 - Romig; Matthew David ;   et al. | 2014-05-08 |
Electronic Assembly with Three Dimensional Inkjet Printed Traces App 20140127856 - Romig; Matthew David ;   et al. | 2014-05-08 |
Electronic Assembly With Three Dimensional Inkjet Printed Traces App 20140054795 - Romig; Matthew David ;   et al. | 2014-02-27 |
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