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name:-0.007349967956543
name:-0.0093140602111816
name:-0.0015339851379395
Stansbury, Darryl M. Patent Filings

Stansbury, Darryl M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stansbury, Darryl M..The latest application filed is for "uphill screen printing in the manufacturing of microelectronic components".

Company Profile
0.7.5
  • Stansbury, Darryl M. - Boise ID
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Uphill screen printing in the manufacturing of microelectronic components
App 20050218382 - Michiels, John M. ;   et al.
2005-10-06
Uphill screen printing in the manufacturing of microelectronic components
Grant 6,901,852 - Michiels , et al. June 7, 2
2005-06-07
Uphill screen printing in the manufacturing of microelectronic components
Grant 6,899,025 - Michiels , et al. May 31, 2
2005-05-31
Uphill screen printing in the manufacturing of microelectronic components
App 20040177777 - Michiels, John J. ;   et al.
2004-09-16
Uphill screen printing in the manufacturing of microelectronic components
App 20040163554 - Michiels, John M. ;   et al.
2004-08-26
Uphill screen printing in the manufacturing of microelectronic components
Grant 6,736,058 - Michiels , et al. May 18, 2
2004-05-18
Uphill screen printing in the manufacturing of microelectronic components
App 20020134259 - Michiels, John M. ;   et al.
2002-09-26
Fiber spacers in large area vacuum displays and method for manufacture of same
App 20010012744 - Cathey, David A. ;   et al.
2001-08-09
Fiber spacers in large area vacuum displays and method for manufacture of same
Grant 6,183,329 - Cathey , et al. February 6, 2
2001-02-06
Self-dimensioning support member for use in a field emission display
Grant 6,077,142 - Stansbury June 20, 2
2000-06-20
Fiber spacers in large area vacuum displays and method for manufacture of same
Grant 5,795,206 - Cathey , et al. August 18, 1
1998-08-18
Method for forming an electrical connection to a semiconductor die using loose lead wire bonding
Grant 5,665,654 - Stansbury September 9, 1
1997-09-09

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