Stansberry; Steven M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Stansberry; Steven M..The latest application filed is for "method for wire bonding an aluminum wire to a lead of an electronics package".
- Stansberry; Steven M. - Elwood IN
| Patent | Date |
|---|---|
| Method for wire bonding an aluminum wire to a lead of an electronics package Grant 5,492,263 - Webster , et al. February 20, 1 | 1996-02-20 |
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