Standing; Martin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Standing; Martin.The latest application filed is for "electrical devices and methods of manufacture".
Company Profile
4.101.98
- Standing; Martin - Velden AT
- Standing; Martin - Villach AT
- Standing; Martin - Tonbridge GB
- Standing; Martin - Kent N/A GB
- Standing; Martin - Tonbrige GB
Patent Activity
| Patent | Date |
|---|---|
| Electrical Devices And Methods Of Manufacture App 20220068823 - Standing; Martin ; et al. | 2022-03-03 |
| Electrical devices and methods of manufacture Grant 11,069,624 - Standing , et al. July 20, 2 | 2021-07-20 |
| Electrical Devices And Methods Of Manufacture App 20200335446 - Standing; Martin ; et al. | 2020-10-22 |
| Electronic component, system and method Grant 10,553,557 - Standing , et al. Fe | 2020-02-04 |
| Interconnection structure, LED module and method Grant 10,361,178 - Standing | 2019-07-23 |
| Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer Grant 10,257,937 - Standing , et al. | 2019-04-09 |
| Electronic component having a heat-sink thermally coupled to a heat-spreader Grant 10,249,551 - Standing | 2019-04-02 |
| Method of inserting an electronic component into a slot in a circuit board Grant 10,192,846 - Standing , et al. Ja | 2019-01-29 |
| Semiconductor Package Including A Semiconductor Die Having Redistributed Pads App 20180366380 - Pavier; Mark ; et al. | 2018-12-20 |
| Semiconductor package including a semiconductor die having redistributed pads Grant 10,103,076 - Pavier , et al. October 16, 2 | 2018-10-16 |
| Chip protection envelope and method Grant 10,074,616 - Standing September 11, 2 | 2018-09-11 |
| System and method of providing a semiconductor carrier and redistribution structure Grant 10,064,287 - Standing , et al. August 28, 2 | 2018-08-28 |
| Electronic component and method for dissipating heat from a semiconductor die Grant 10,032,688 - Standing , et al. July 24, 2 | 2018-07-24 |
| Electronic component, arrangement and method Grant 9,978,719 - Standing May 22, 2 | 2018-05-22 |
| Power in lead Grant 9,974,187 - Standing , et al. May 15, 2 | 2018-05-15 |
| Electronic component and method for electrically coupling a semiconductor die to a contact pad Grant 9,917,024 - Standing , et al. March 13, 2 | 2018-03-13 |
| Semiconductor Package With Conductive Clip App 20180012859 - Standing; Martin | 2018-01-11 |
| High performance vertical interconnection Grant 9,867,277 - Standing , et al. January 9, 2 | 2018-01-09 |
| Method for forming a reliable solderable contact Grant 9,852,940 - Standing , et al. December 26, 2 | 2017-12-26 |
| Solderable contact and passivation for semiconductor dies Grant 9,852,939 - Standing , et al. December 26, 2 | 2017-12-26 |
| Semiconductor package with integrated semiconductor devices and passive component Grant 9,837,393 - Standing December 5, 2 | 2017-12-05 |
| Packaged semiconductor device with internal electrical connections to outer contacts Grant 9,831,147 - Standing November 28, 2 | 2017-11-28 |
| Semiconductor packages and methods of forming the same Grant 9,824,977 - Standing , et al. November 21, 2 | 2017-11-21 |
| Electronic Component Having a Heat-Sink Thermally Coupled to a Heat-Spreader App 20170317005 - Standing; Martin | 2017-11-02 |
| Semiconductor package with conductive clip Grant 9,799,623 - Standing October 24, 2 | 2017-10-24 |
| High efficiency embedding technology Grant 9,769,928 - Standing September 19, 2 | 2017-09-19 |
| Electronic component Grant 9,741,635 - Standing August 22, 2 | 2017-08-22 |
| Power Supply And Method App 20170196118 - Standing; Martin | 2017-07-06 |
| Chip Protection Envelope and Method App 20170154856 - Standing; Martin | 2017-06-01 |
| Electronic Component and Method App 20170154831 - Standing; Martin | 2017-06-01 |
| Semiconductor Package Including A Semiconductor Die Having Redistributed Pads App 20170148692 - Pavier; Mark ; et al. | 2017-05-25 |
| Systems and methods for embedding devices in printed circuit board structures Grant 9,653,370 - Standing , et al. May 16, 2 | 2017-05-16 |
| Method for fabricating a semiconductor package Grant 9,653,322 - Standing , et al. May 16, 2 | 2017-05-16 |
| Power supply and method Grant 9,642,289 - Standing May 2, 2 | 2017-05-02 |
| Semiconductor package including a semiconductor die having redistributed pads Grant 9,633,951 - Pavier , et al. April 25, 2 | 2017-04-25 |
| Power semiconductor package with conductive clips Grant 9,620,471 - Standing , et al. April 11, 2 | 2017-04-11 |
| Power Supply and Method App 20170094842 - Standing; Martin | 2017-03-30 |
| Interconnection Structure, LED Module and Method App 20170092631 - Standing; Martin | 2017-03-30 |
| Passive component integrated with semiconductor device in semiconductor package Grant 9,595,512 - Standing March 14, 2 | 2017-03-14 |
| Semiconductor Package With Integrated Semiconductor Devices And Passive Component App 20170062395 - Standing; Martin | 2017-03-02 |
| Electronic component Grant 9,559,056 - Standing January 31, 2 | 2017-01-31 |
| Passive component as thermal capacitance and heat sink Grant 9,559,047 - Standing , et al. January 31, 2 | 2017-01-31 |
| Power semiconductor package Grant 9,496,205 - Standing November 15, 2 | 2016-11-15 |
| Semiconductor package with integrated semiconductor devices and passive component Grant 9,496,245 - Standing November 15, 2 | 2016-11-15 |
| Electronic Component and Method for Electrically Coupling a Semiconductor Die to a Contact Pad App 20160322271 - Standing; Martin ; et al. | 2016-11-03 |
| Methods for manufacturing an electronic module Grant 9,472,541 - Standing , et al. October 18, 2 | 2016-10-18 |
| Semiconductor Package with Conductive Clip App 20160300811 - Standing; Martin | 2016-10-13 |
| Semiconductor Packages And Methods Of Forming The Same App 20160293550 - STANDING; MARTIN ; et al. | 2016-10-06 |
| Electronic component and method for electrically coupling a semiconductor die to a contact pad Grant 9,418,925 - Standing , et al. August 16, 2 | 2016-08-16 |
| Semiconductor package with conductive clip Grant 9,391,003 - Standing July 12, 2 | 2016-07-12 |
| Power semiconductor package with conductive clip and related method Grant 9,391,004 - Standing July 12, 2 | 2016-07-12 |
| System and Method App 20160128197 - Standing; Martin ; et al. | 2016-05-05 |
| Electronic Component, System and Method App 20160126210 - Standing; Martin ; et al. | 2016-05-05 |
| Electronic Component App 20160128198 - Standing; Martin ; et al. | 2016-05-05 |
| Electronic Component App 20160086881 - Standing; Martin | 2016-03-24 |
| Semiconductor packages and methods of forming the same Grant 9,281,260 - Standing , et al. March 8, 2 | 2016-03-08 |
| Passive Component Integrated With Semiconductor Device In Semiconductor Package App 20160013169 - Standing; Martin | 2016-01-14 |
| Semiconductor Package with Integrated Semiconductor Devices and Passive Component App 20160013168 - Standing; Martin | 2016-01-14 |
| Method and Device for Electrically Coupling a Plurality of Semiconductor Device Layers by a Common Conductive Layer App 20160007470 - Standing; Martin ; et al. | 2016-01-07 |
| Electronic component and method for electrically coupling a semiconductor die to a contact pad App 20160005684 - Standing; Martin ; et al. | 2016-01-07 |
| Electronic component and method for dissipating heat from a semiconductor die App 20160005673 - Standing; Martin ; et al. | 2016-01-07 |
| Methods for Manufacturing an Electronic Module App 20150371979 - Standing; Martin ; et al. | 2015-12-24 |
| Embedded Chip Packaging Technology App 20150371935 - STANDING; Martin ; et al. | 2015-12-24 |
| Power Semiconductor Package App 20150340304 - Standing; Martin | 2015-11-26 |
| Semiconductor Package with Multiple Dies App 20150332988 - Standing; Martin | 2015-11-19 |
| High Efficiency Embedding Technology App 20150319864 - STANDING; Martin | 2015-11-05 |
| Semiconductor device and passive component integration in a semiconductor package Grant 9,147,644 - Standing September 29, 2 | 2015-09-29 |
| Power Semiconductor Package with Conductive Clips App 20150262960 - Standing; Martin ; et al. | 2015-09-17 |
| Power Semiconductor Package App 20150255376 - Standing; Martin | 2015-09-10 |
| Semiconductor Package with Conductive Clip App 20150255382 - Standing; Martin | 2015-09-10 |
| Electronic Component, Arrangement and Method App 20150216054 - Standing; Martin | 2015-07-30 |
| Electronic Component App 20150206820 - Standing; Martin | 2015-07-23 |
| Method of embedding an electronic component into an aperture of a substrate Grant 9,084,382 - Standing July 14, 2 | 2015-07-14 |
| Electronic module Grant 9,070,642 - Standing , et al. June 30, 2 | 2015-06-30 |
| Power semiconductor package Grant 9,054,090 - Standing June 9, 2 | 2015-06-09 |
| Power semiconductor package Grant 9,048,196 - Standing , et al. June 2, 2 | 2015-06-02 |
| Power semiconductor package Grant 9,041,191 - Standing May 26, 2 | 2015-05-26 |
| Power semiconductor package with multiple dies Grant 9,041,187 - Standing May 26, 2 | 2015-05-26 |
| Power Supply and Method App 20150078042 - Standing; Martin | 2015-03-19 |
| Chip module and method for fabricating a chip module Grant 8,970,032 - Otremba , et al. March 3, 2 | 2015-03-03 |
| Power Semiconductor Package with Multiple Dies App 20150008572 - Standing; Martin | 2015-01-08 |
| Power Semiconductor Package App 20140319665 - Standing; Martin | 2014-10-30 |
| Power In Lead App 20140311794 - STANDING; Martin ; et al. | 2014-10-23 |
| Three Dimensional Packaging App 20140307391 - STANDING; Martin | 2014-10-16 |
| Semiconductor package Grant 8,786,072 - Standing July 22, 2 | 2014-07-22 |
| Method of producing laminated device Grant 8,759,156 - Standing June 24, 2 | 2014-06-24 |
| Systems And Methods For Embedding Devices In Printed Circuit Board Structures App 20140153206 - Standing; Martin ; et al. | 2014-06-05 |
| High Efficiency Embedding Technology App 20140111955 - STANDING; Martin | 2014-04-24 |
| High Performance Vertical Interconnection App 20140111951 - STANDING; Martin ; et al. | 2014-04-24 |
| Passive Component As Thermal Capacitance And Heat Sink App 20140110820 - STANDING; Martin ; et al. | 2014-04-24 |
| Vertically mountable semiconductor device package Grant 8,686,554 - Standing April 1, 2 | 2014-04-01 |
| Method for manufacturing a semiconductor package Grant 8,603,858 - Standing , et al. December 10, 2 | 2013-12-10 |
| Semiconductor Packages and Methods of Forming The Same App 20130234283 - Standing; Martin ; et al. | 2013-09-12 |
| Chip-scale package Grant 8,466,546 - Farlow , et al. June 18, 2 | 2013-06-18 |
| Method for Forming a Reliable Solderable Contact App 20130143399 - Standing; Martin ; et al. | 2013-06-06 |
| Solderable Contact and Passivation for Semiconductor Dies App 20130140701 - Standing; Martin ; et al. | 2013-06-06 |
| Chip Module and Method for Fabricating a Chip Module App 20130069243 - Otremba; Ralf ; et al. | 2013-03-21 |
| Electronic Module App 20130062706 - Standing; Martin ; et al. | 2013-03-14 |
| Paste for forming an interconnect and interconnect formed from the paste Grant 8,368,223 - Standing February 5, 2 | 2013-02-05 |
| Solderable top metalization and passivation for source mounted package Grant 8,368,211 - Standing , et al. February 5, 2 | 2013-02-05 |
| Method For Manufacturing A Semiconductor Package App 20130017651 - Standing; Martin ; et al. | 2013-01-17 |
| Method Of Producing Laminated Device App 20130011972 - Standing; Martin | 2013-01-10 |
| Embedded laminated device Grant 8,319,334 - Standing November 27, 2 | 2012-11-27 |
| Multi-phase voltage regulation module Grant 8,264,073 - Standing September 11, 2 | 2012-09-11 |
| Power Semiconductor Package App 20120061725 - Standing; Martin | 2012-03-15 |
| Protective barrier layer for semiconductor device electrodes Grant 8,125,083 - Carroll , et al. February 28, 2 | 2012-02-28 |
| Conductive chip-scale package Grant 8,097,938 - Standing , et al. January 17, 2 | 2012-01-17 |
| Paste for forming an interconnect and interconnect formed from the paste Grant 8,083,832 - Standing December 27, 2 | 2011-12-27 |
| Process of fabricating a semiconductor package Grant 8,061,023 - Standing November 22, 2 | 2011-11-22 |
| Universal pad arrangement for surface mounted semiconductor devices Grant 7,968,984 - Standing , et al. June 28, 2 | 2011-06-28 |
| Embedded Laminated Device App 20110031611 - Standing; Martin | 2011-02-10 |
| Semiconductor device and passive component integration in a semiconductor package App 20100102327 - Standing; Martin | 2010-04-29 |
| Semiconductor package Grant 7,592,688 - Standing September 22, 2 | 2009-09-22 |
| Chip Scale Package App 20090174058 - Standing; Martin ; et al. | 2009-07-09 |
| Multi-phase Voltage Regulation Module App 20090108821 - Standing; Martin | 2009-04-30 |
| Chip-scale package Grant 7,524,701 - Standing , et al. April 28, 2 | 2009-04-28 |
| Semiconductor device package utilizing proud interconnect material Grant 7,482,681 - Standing January 27, 2 | 2009-01-27 |
| High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing Grant 7,476,964 - Standing January 13, 2 | 2009-01-13 |
| Chip scale surface mounted device and process of manufacture Grant 7,476,979 - Standing , et al. January 13, 2 | 2009-01-13 |
| Power semiconductor package App 20090008804 - Standing; Martin ; et al. | 2009-01-08 |
| Power semiconductor package Grant 7,466,012 - Standing , et al. December 16, 2 | 2008-12-16 |
| Paste For Forming An Interconnect And Interconnect Formed From The Paste App 20080230152 - Standing; Martin | 2008-09-25 |
| Semiconductor Package App 20080230889 - Standing; Martin | 2008-09-25 |
| Vertically mountable semiconductor device package App 20080224286 - Standing; Martin | 2008-09-18 |
| Semiconductor package fabrication Grant 7,402,507 - Standing , et al. July 22, 2 | 2008-07-22 |
| Semiconductor package Grant 7,368,325 - Standing May 6, 2 | 2008-05-06 |
| Semiconductor device package Grant 7,364,949 - Standing April 29, 2 | 2008-04-29 |
| Semiconductor Package App 20080066303 - Standing; Martin | 2008-03-20 |
| Semiconductor device package utilizing proud interconnect material Grant 7,315,081 - Standing January 1, 2 | 2008-01-01 |
| Semiconductor device package utilizing proud interconnect material App 20070284722 - Standing; Martin | 2007-12-13 |
| Surface mounted package with die bottom spaced from support board Grant 7,285,866 - Standing , et al. October 23, 2 | 2007-10-23 |
| Chip-scale package App 20070215997 - Standing; Martin | 2007-09-20 |
| Semiconductor package App 20070202631 - Standing; Martin | 2007-08-30 |
| Chip scale surface mounted device and process of manufacture Grant 7,253,090 - Standing , et al. August 7, 2 | 2007-08-07 |
| Multi-chip semiconductor package App 20070164423 - Standing; Martin | 2007-07-19 |
| Semiconductor package Grant 7,230,333 - Standing June 12, 2 | 2007-06-12 |
| Semiconductor package including a semiconductor die having redistributed pads App 20070108585 - Pavier; Mark ; et al. | 2007-05-17 |
| Universal Pad Arrangement For Surface Mounted Semiconductor Devices App 20070091546 - Standing; Martin ; et al. | 2007-04-26 |
| Protective barrier layer for semiconductor device electrodes App 20070052099 - Carroll; Martin ; et al. | 2007-03-08 |
| Chip-scale package App 20060249836 - Farlow; Andy ; et al. | 2006-11-09 |
| Chip scale package App 20060240598 - Standing; Martin ; et al. | 2006-10-26 |
| Semiconductor package App 20060237840 - Standing; Martin | 2006-10-26 |
| Chip scale surface mounted device and process of manufacture Grant 7,122,887 - Standing , et al. October 17, 2 | 2006-10-17 |
| Chip scale surface mounted device and process of manufacture App 20060220123 - Standing; Martin ; et al. | 2006-10-05 |
| Semiconductor package fabrication App 20060205112 - Standing; Martin ; et al. | 2006-09-14 |
| Flip-chip device having conductive connectors Grant 7,088,004 - Standing August 8, 2 | 2006-08-08 |
| Power semiconductor package App 20060131760 - Standing; Martin ; et al. | 2006-06-22 |
| Semiconductor device package App 20060128067 - Standing; Martin | 2006-06-15 |
| Semiconductor device package Grant 7,045,884 - Standing May 16, 2 | 2006-05-16 |
| Preparation of front contact for surface mounting App 20050269677 - Standing, Martin ; et al. | 2005-12-08 |
| Wafer level underfill and interconnect process Grant 6,967,412 - Standing November 22, 2 | 2005-11-22 |
| Surface mounted package with die bottom spaced from support board App 20050224960 - Standing, Martin ; et al. | 2005-10-13 |
| Solderable top metalization and passivation for source mounted package App 20050200011 - Standing, Martin ; et al. | 2005-09-15 |
| Chip scale surface mounted device and process of manufacture App 20050186707 - Standing, Martin ; et al. | 2005-08-25 |
| Surface mounted package with die bottom spaced from support board Grant 6,930,397 - Standing , et al. August 16, 2 | 2005-08-16 |
| Semiconductor device package utilizing proud interconnect material App 20050121784 - Standing, Martin | 2005-06-09 |
| Chip scale surface mounted device and process of manufacture Grant 6,890,845 - Standing , et al. May 10, 2 | 2005-05-10 |
| Paste for forming an interconnect and interconnect formed from the paste App 20050093164 - Standing, Martin | 2005-05-05 |
| Conductive clip for a semiconductor package Grant D503,691 - Standing , et al. April 5, 2 | 2005-04-05 |
| Semiconductor package Grant D502,151 - Standing February 22, 2 | 2005-02-22 |
| Semiconductor device having clips for connecting to external elements Grant 6,841,865 - Standing January 11, 2 | 2005-01-11 |
| Chip scale surface mounted device and process of manufacture App 20040224438 - Standing, Martin ; et al. | 2004-11-11 |
| Chip scale surface mounted device and process of manufacture Grant 6,767,820 - Standing , et al. July 27, 2 | 2004-07-27 |
| Semiconductor device package App 20040119148 - Standing, Martin | 2004-06-24 |
| Flip-chip device having conductive connectors App 20040099941 - Standing, Martin | 2004-05-27 |
| Semiconductor device having clips for connecting to external elements App 20040099940 - Standing, Martin | 2004-05-27 |
| Chip scale surface mounted device and process of manufacture App 20040038509 - Standing, Martin ; et al. | 2004-02-26 |
| Chip scale surface mounted device and process of manufacture App 20040026796 - Standing, Martin ; et al. | 2004-02-12 |
| Semiconductor package including two semiconductor die disposed within a common clip Grant 6,677,669 - Standing January 13, 2 | 2004-01-13 |
| Wafer level underfill and interconnect process App 20030207490 - Standing, Martin | 2003-11-06 |
| Chip scale surface mounted device and process of manufacture Grant 6,624,522 - Standing , et al. September 23, 2 | 2003-09-23 |
| Semiconductor device with co-packaged die App 20030137040 - Standing, Martin | 2003-07-24 |
| Surface mounted package with die bottom spaced from support board App 20030132531 - Standing, Martin ; et al. | 2003-07-17 |
| Wafer level underfill and interconnect process Grant 6,582,990 - Standing June 24, 2 | 2003-06-24 |
| Wafer level insulation underfill for die attach Grant 6,573,122 - Standing June 3, 2 | 2003-06-03 |
| Wafer level underfill and interconnect process App 20030038342 - Standing, Martin | 2003-02-27 |
| High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing App 20030001247 - Standing, Martin | 2003-01-02 |
| Wafer level insulation underfill for die attach App 20020146861 - Standing, Martin | 2002-10-10 |
| Chip scale surface mounted device and process of manufacture App 20010048116 - Standing, Martin ; et al. | 2001-12-06 |
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