| Patent | Date |
|---|
Component Carrier-Based Device With Antenna Coupling of Electronic Component and Thermal Coupling on Opposing Sides
App 20220140475 - SCHOBER; Mario ; et al. | 2022-05-05 |
Component carrier and method of manufacturing the same
Grant 11,324,122 - Moitzi , et al. May 3, 2 | 2022-05-03 |
Component carrier with integrated antenna structure
Grant 11,264,708 - Kristl , et al. March 1, 2 | 2022-03-01 |
Method for producing a printed circuit board structure
Grant 11,172,576 - Stahr , et al. November 9, 2 | 2021-11-09 |
Component Carrier With a Stepped Cavity and a Stepped Component Assembly Embedded Within the Stepped Cavity
App 20210280479 - Stahr; Johannes ; et al. | 2021-09-09 |
Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity
Grant 11,049,778 - Stahr , et al. June 29, 2 | 2021-06-29 |
Component Carrier With Embedded Magnetic Inlay and Integrated Coil Structure
App 20210195749 - Salkovic; Ivan ; et al. | 2021-06-24 |
Component Carrier and Method of Manufacturing the Same
App 20210112666 - Moitzi; Heinz ; et al. | 2021-04-15 |
Connection Arrangement, Component Carrier and Method of Forming a Component Carrier Structure
App 20210074662 - Moitzi; Heinz ; et al. | 2021-03-11 |
Component Carrier and Method of Manufacturing the Same
App 20210068252 - Stahr; Johannes ; et al. | 2021-03-04 |
Inductor Made of Component Carrier Material Comprising Electrically Conductive Plate Structures
App 20210050141 - Stahr; Johannes ; et al. | 2021-02-18 |
Component carrier comprising at least one heat pipe and method for producing said component carrier
Grant 10,867,888 - de Sousa , et al. December 15, 2 | 2020-12-15 |
Inductor made of component carrier material comprising electrically conductive plate structures
Grant 10,861,636 - Stahr , et al. December 8, 2 | 2020-12-08 |
Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure
Grant 10,863,631 - Stahr , et al. December 8, 2 | 2020-12-08 |
Component Carrier With Surface-Contactable Component Embedded in Laminated Stack
App 20200365477 - Moitzi; Heinz ; et al. | 2020-11-19 |
Hermetic Optical Component Package Having Organic Portion and Inorganic Portion
App 20200365573 - Zluc; Andreas ; et al. | 2020-11-19 |
Method for Embedding a Component in a Printed Circuit Board
App 20200323081 - Schwarz; Timo ; et al. | 2020-10-08 |
Component Carrier With Embedded Semiconductor Component and Embedded Highly-Conductive Block Which are Mutually Coupled
App 20200312737 - Stahr; Johannes ; et al. | 2020-10-01 |
Method of embedding a component in a printed circuit board
Grant 10,779,413 - Schwarz , et al. Sept | 2020-09-15 |
Component Carrier Comprising at Least One Heat Pipe and Method for Producing Said Component Carrier
App 20200243417 - de Sousa; Jonathan Silvano ; et al. | 2020-07-30 |
Methods of Manufacturing Flexible Electronic Devices
App 20200205296 - Zluc; Andreas ; et al. | 2020-06-25 |
Component carrier comprising at least one heat pipe and method for producing said component carrier
Grant 10,665,526 - de Sousa , et al. | 2020-05-26 |
Methods of manufacturing flexible printed circuit boards
Grant 10,617,012 - Zluc , et al. | 2020-04-07 |
Component Carrier With a Stepped Cavity and a Stepped Component Assembly Embedded Within the Stepped Cavity
App 20190378771 - Stahr; Johannes ; et al. | 2019-12-12 |
Conductor Track With Enlargement-Free Transition Between Conductor Path and Contact Structure
App 20190306983 - Stahr; Johannes ; et al. | 2019-10-03 |
Method for producing a circuit board element
Grant 10,426,040 - Stahr , et al. Sept | 2019-09-24 |
Layer Stack of Component Carrier Material With Embedded Components and Common High Temperature Robust Dielectric Structure
App 20190281706 - Stahr; Johannes ; et al. | 2019-09-12 |
Method for the Production of an Electronic Module Having an Electronic Component Embedded Therein
App 20190221718 - Langer; Gregor ; et al. | 2019-07-18 |
Conductor track with enlargement-free transition between conductor path and contact structure
Grant 10,356,904 - Stahr , et al. July 16, 2 | 2019-07-16 |
Efficient heat removal from component carrier with embedded diode
Grant 10,332,818 - Morianz , et al. | 2019-06-25 |
Circuit Board Structure
App 20190150288 - Stahr; Johannes ; et al. | 2019-05-16 |
Method for the production of an electronic module having an electronic component embedded therein
Grant 10,283,680 - Langer , et al. | 2019-05-07 |
Method for Making Contact with a Component Embedded in a Printed Circuit Board
App 20190082543 - Weidinger; Gerald ; et al. | 2019-03-14 |
Circuit board structure
Grant 10,219,384 - Stahr , et al. Feb | 2019-02-26 |
Method for making contact with a component embedded in a printed circuit board
Grant 10,187,997 - Weidinger , et al. Ja | 2019-01-22 |
Printed circuit board
Grant 10,165,685 - Leitgeb , et al. Dec | 2018-12-25 |
Component Carrier With Integrated Antenna Structure
App 20180277943 - Kristl; Thomas ; et al. | 2018-09-27 |
Use Of Nonstick Material For The Production Of Cavities In A Printed Circuit Board
App 20180257364 - Weidinger; Gerald ; et al. | 2018-09-13 |
Efficient Heat Removal From Component Carrier With Embedded Diode
App 20180211899 - MORIANZ; Mike ; et al. | 2018-07-26 |
Inductor Made of Component Carrier Material Comprising Electrically Conductive Plate Structures
App 20180182532 - Stahr; Johannes ; et al. | 2018-06-28 |
Printed circuit board consisting of at least two printed circuit board regions
Grant 9,980,380 - Pludra , et al. May 22, 2 | 2018-05-22 |
Component Carrier Comprising at Least One Heat Pipe and Method for Producing Said Component Carrier
App 20180096912 - de Sousa; Jonathan Silvano ; et al. | 2018-04-05 |
Semi-finished product for the production of a printed circuit board and method for producing the same
Grant 9,781,845 - Stahr , et al. October 3, 2 | 2017-10-03 |
Printed Circuit Board
App 20170238422 - LEITGEB; Markus ; et al. | 2017-08-17 |
Methods of Manufacturing Flexible Electronic Devices
App 20170231098 - Zluc; Andreas ; et al. | 2017-08-10 |
Circuit Board Structure
App 20170164481 - Stahr; Johannes ; et al. | 2017-06-08 |
Printed circuit board comprising an electronic component integrated therein
Grant 9,674,960 - Stahr , et al. June 6, 2 | 2017-06-06 |
Conductor Track With Enlargement-Free Transition Between Conductor Path and Contact Structure
App 20170094795 - Stahr; Johannes ; et al. | 2017-03-30 |
Printed Circuit Board Consisting Of At Least Two Printed Circuit Board Regions
App 20170042028 - PLUDRA; Rainer ; et al. | 2017-02-09 |
Printed Circuit Board
App 20160330840 - Leitgeb; Markus ; et al. | 2016-11-10 |
Method for the Production of an Electronic Module as Well as Corresponding Electronic Module
App 20160329469 - Langer; Gregor ; et al. | 2016-11-10 |
Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
Grant 9,491,862 - Pludra , et al. November 8, 2 | 2016-11-08 |
Method for Embedding a Component in a Printed Circuit Board
App 20160324004 - Schwarz; Timo ; et al. | 2016-11-03 |
Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
Grant 9,480,172 - Karpovych , et al. October 25, 2 | 2016-10-25 |
Power module
Grant 9,418,930 - Stahr , et al. August 16, 2 | 2016-08-16 |
Power Module
App 20160133558 - Stahr; Johannes ; et al. | 2016-05-12 |
Method For Producing A Circuit Board Element
App 20160044794 - STAHR; Johannes ; et al. | 2016-02-11 |
Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product
Grant 9,253,888 - Weidinger , et al. February 2, 2 | 2016-02-02 |
Semi-finished Product for the Production of a Printed Circuit Board and Method for Producing the Same
App 20160021763 - Stahr; Johannes ; et al. | 2016-01-21 |
Printed Circuit Board Comprising An Electronic Component Integrated Therein
App 20150237733 - Stahr; Johannes ; et al. | 2015-08-20 |
Method for integrating an electronic component into a printed circuit board
Grant 9,055,706 - Stahr , et al. June 9, 2 | 2015-06-09 |
Method For Producing A Printed Circuit Board Consisting Of At Least Two Printed Circuit Board Regions, And Printed Circuit Board
App 20140376196 - Karpovych; Volodymyr ; et al. | 2014-12-25 |
Method For Integrating An Electronic Component Into A Printed Circuit Board
App 20140307403 - Weichslberger; Gunther ; et al. | 2014-10-16 |
Method For Producing A Multilayer Printed Circuit Board, Adhesion Prevention Material And Multilayer Printed Circuit Board And Use Of Such A Method
App 20140216795 - Weichslberger; Gunther ; et al. | 2014-08-07 |
Method for integrating an electronic component into a printed circuit board
Grant 8,789,271 - Weichslberger , et al. July 29, 2 | 2014-07-29 |
Printed circuit board element and method for the production thereof
Grant 8,705,905 - Langer , et al. April 22, 2 | 2014-04-22 |
Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method
Grant 8,685,196 - Weichslberger , et al. April 1, 2 | 2014-04-01 |
Method For Integrating An Electronic Component Into A Printed Circuit Board Or A Printed Circuit Board Intermediate Product, And Printed Circuit Board Or Printed Circuit Board Intermediate Product
App 20140000941 - Weidinger; Gerald ; et al. | 2014-01-02 |
Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
Grant 8,541,690 - Voraberger , et al. September 24, 2 | 2013-09-24 |
Method for removing a part of a planar material layer and multilayer structure
Grant 8,541,689 - Weidinger , et al. September 24, 2 | 2013-09-24 |
Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board
Grant 8,500,938 - Stahr , et al. August 6, 2 | 2013-08-06 |
Nonstick Material, Method For Removing A Part Of A Planar Material Layer And Multilayer Structure And Use Therefor
App 20130149506 - Weidinger; Gerald ; et al. | 2013-06-13 |
Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor
Grant 8,388,792 - Weidinger , et al. March 5, 2 | 2013-03-05 |
Method For Integrating An Electronic Component Into A Printed Circuit Board, And Printed Circuit Board Comprising An Electronic Component Integrated Therein
App 20130008703 - Stahr; Johannes ; et al. | 2013-01-10 |
Method For Producing A Printed Circuit Board Consisting Of At Least Two Printed Circuit Board Regions, And Printed Circuit Board
App 20120275124 - Pludra; Rainer ; et al. | 2012-11-01 |
Method For Producing A Multilayer Printed Circuit Board, Adhesion Prevention Material And Multilayer Printed Circuit Board And Use Of Such A Method
App 20110272177 - Weichslberger; Gunther ; et al. | 2011-11-10 |
Method for manufacturing a printed circuit board element as well as a printed circuit board element
Grant 8,039,755 - Bauer , et al. October 18, 2 | 2011-10-18 |
Method For Producing A Printed Circuit Board And Use And Printed Circuit Board
App 20110067908 - Weichslberger; Gunther ; et al. | 2011-03-24 |
Method For Integrating At Least One Electronic Component Into A Printed Circuit Board, And Printed Circuit Board
App 20110069448 - Weichslberger; Gunther ; et al. | 2011-03-24 |
Printed Circuit Board Element Having At Least One Component Embedded Therein And Method For Embedding At Least One Component In A Printed Circuit Board Element
App 20110051384 - Kriechbaum; Arno ; et al. | 2011-03-03 |
Method For Removing A Part Of A Planar Material Layer And Multilayer Structure
App 20100059262 - Weidinger; Gerald ; et al. | 2010-03-11 |
Method For Producing A Flexi-rigid Printed Circuit Board And Flexi-rigid Printed Circuit Board
App 20100025086 - Stahr; Johannes ; et al. | 2010-02-04 |
Nonstick Material, Method For Removing A Part Of A Planar Material Layer And Multilayer Structure And Use Therefor
App 20100009178 - Weidinger; Gerald ; et al. | 2010-01-14 |
Method For Manufacturing A Printed Circuit Board Element As Well As A Printed Circuit Board Element
App 20090229867 - BAUER; Wolfgang ; et al. | 2009-09-17 |
Method for the production of a circuit board element
Grant 7,552,525 - Bauer , et al. June 30, 2 | 2009-06-30 |
Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
App 20090101398 - Voraberger; Hannes ; et al. | 2009-04-23 |
Method for Coating Blanks for the Production of Printed Circuit Boards (Pcb)
App 20080032109 - Leising; Gunther ; et al. | 2008-02-07 |
Method for the Production of a Circuit Board Element and Circuit Board Element
App 20070143991 - Bauer; Wolfgang ; et al. | 2007-06-28 |
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