| Patent | Date |
|---|
Beverage machine
Grant D954,483 - Regamey , et al. June 14, 2 | 2022-06-14 |
Method for producing a micromechanical element
Grant 10,889,491 - Kuhnke , et al. January 12, 2 | 2021-01-12 |
Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component
Grant 10,775,253 - Stahl , et al. Sept | 2020-09-15 |
Polycrystalline material having low mechanical strain; method for producing a polycrystalline material
Grant 10,766,778 - Hartlieb , et al. Sep | 2020-09-08 |
Method For Producing A Micromechanical Component With An Exposed Pressure Sensor Device And Micromechanical Component
App 20200225108 - Stahl; Heiko ; et al. | 2020-07-16 |
Method for producing at least one via in a wafer
Grant 10,643,896 - Stahl , et al. | 2020-05-05 |
Method for producing a micromechanical component
Grant 10,336,610 - Stahl , et al. | 2019-07-02 |
Method for Producing at least One Via in a Wafer
App 20190096762 - Stahl; Heiko ; et al. | 2019-03-28 |
Method for Producing a Micromechanical Element
App 20190092628 - Kuhnke; Markus ; et al. | 2019-03-28 |
Polycrystalline Material Having Low Mechanical Strain; Method For Producing A Polycrystalline Material
App 20180346339 - Hartlieb; Andreas ; et al. | 2018-12-06 |
Method For Producing A Micromechanical Component
App 20180111828 - Stahl; Heiko ; et al. | 2018-04-26 |
Micromechanical Component Having Integrated Passive Electronic Components And Method For Its Production
App 20170283253 - Stahl; Heiko ; et al. | 2017-10-05 |
Capacitive MEMS-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodes
Grant 9,725,300 - Stahl , et al. August 8, 2 | 2017-08-08 |
System and method for cryptographic key identification
Grant 9,667,419 - Guajardo Merchan , et al. May 30, 2 | 2017-05-30 |
Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type
Grant 9,650,240 - Hattass , et al. May 16, 2 | 2017-05-16 |
Capacitive Mems-sensor Element Having Bond Pads For The Electrical Contacting Of The Measuring Capacitor Electrodes
App 20160280534 - Stahl; Heiko ; et al. | 2016-09-29 |
Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component
Grant 9,428,378 - Heuck , et al. August 30, 2 | 2016-08-30 |
Component Including Two Semiconductor Elements, Whichare Bonded To One Another Via A Structured Bonding Layer, Andmethod For Manufacturing A Component Of This Type
App 20150353349 - HATTASS; Mirko ; et al. | 2015-12-10 |
Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component
App 20150353346 - HEUCK; Friedjof ; et al. | 2015-12-10 |
Micromechanical component having a bond joint
Grant 9,206,034 - Stahl , et al. December 8, 2 | 2015-12-08 |
Layer Structure For A Micromechanical Component
App 20150232331 - GROSSE; Axel ; et al. | 2015-08-20 |
System And Method For Cryptographic Key Identification
App 20150200775 - Guajardo Merchan; Jorge ; et al. | 2015-07-16 |
Micromechanical component having a bond joint
App 20140117471 - STAHL; Heiko ; et al. | 2014-05-01 |
Method for producing MEMS structures, and MEMS structure
Grant 8,563,344 - Reinmuth , et al. October 22, 2 | 2013-10-22 |
Method for producing a micromechanical component
Grant 8,492,188 - Stahl , et al. July 23, 2 | 2013-07-23 |
Sensor element and method for operating a sensor element
Grant 8,402,827 - Stahl , et al. March 26, 2 | 2013-03-26 |
Micromechanical acceleration sensor having an open seismic mass
Grant 8,393,215 - Stahl , et al. March 12, 2 | 2013-03-12 |
Method for producing MEMS structures, and MEMS structure
App 20120133002 - REINMUTH; Jochen ; et al. | 2012-05-31 |
Method For Producing A Micromechanical Component
App 20120129291 - Stahl; Heiko ; et al. | 2012-05-24 |
Micromechanical component having multiple caverns, and manufacturing method
Grant 8,174,082 - Fischer , et al. May 8, 2 | 2012-05-08 |
Sensor Element And Method For Operating A Sensor Element
App 20110030475 - Stahl; Heiko ; et al. | 2011-02-10 |
Micromechanical diaphragm sensor having a double diaphragm
Grant 7,863,072 - Illing , et al. January 4, 2 | 2011-01-04 |
Micropump having a pump diaphragm and a polysilicon layer
Grant 7,740,459 - Fuertsch , et al. June 22, 2 | 2010-06-22 |
Micromechanical Acceleration Sensor Having An Open Seismic Mass
App 20090314085 - Stahl; Heiko ; et al. | 2009-12-24 |
Micromechanical diaphragm sensor having a double diaphragm
App 20090206422 - Illing; Matthias ; et al. | 2009-08-20 |
Micromechanical component having an anodically bonded cap and a manufacturing method
Grant 7,436,076 - Stahl , et al. October 14, 2 | 2008-10-14 |
Micromechanical component having integrated passive electronic components and method for its production
App 20080164564 - Stahl; Heiko ; et al. | 2008-07-10 |
Micromechanical Component Having Multiple Caverns, and Manufacturing Method
App 20080136000 - Fischer; Frank ; et al. | 2008-06-12 |
Micromechanical component having an anodically bonded cap and a manufacturing method
App 20070087465 - Stahl; Heiko ; et al. | 2007-04-19 |
Method for the production of a micromechanical part preferably used for fluidic applications, and micropump comprising a pump membrane made of a polysilicon layer
App 20060186085 - Fuertsch; Matthias ; et al. | 2006-08-24 |
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