loadpatents
name:-0.021978855133057
name:-0.017144918441772
name:-0.0022459030151367
Stadler; Bernd Patent Filings

Stadler; Bernd

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stadler; Bernd.The latest application filed is for "semiconductor device including a mems die".

Company Profile
0.19.17
  • Stadler; Bernd - Donaustauf DE
  • Stadler; Bernd - Eberdingen DE
  • Stadler, Bernd - Donaustauff DE
  • Stadler; Bernd - Weissach DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Device Including A Mems Die
App 20170283247 - Meyer; Thorsten ;   et al.
2017-10-05
Sensor module
Grant 9,177,879 - Theuss , et al. November 3, 2
2015-11-03
Molded semiconductor package with backside die metallization
Grant 9,099,454 - Wachter , et al. August 4, 2
2015-08-04
Molded Semiconductor Package with Backside Die Metallization
App 20150041967 - Wachter; Ulrich ;   et al.
2015-02-12
Module including a micro-electro-mechanical microphone
Grant 8,767,983 - Theuss , et al. July 1, 2
2014-07-01
Sensor Module
App 20120162948 - Theuss; Horst ;   et al.
2012-06-28
Sensor module
Grant 8,130,506 - Theuss , et al. March 6, 2
2012-03-06
Exhaust system
Grant 7,874,150 - Stadler , et al. January 25, 2
2011-01-25
Sensor Module
App 20090313817 - Theuss; Horst ;   et al.
2009-12-24
Chip carrier and system including a chip carrier and semiconductor chips
Grant 7,635,911 - Auburger , et al. December 22, 2
2009-12-22
Rear muffler assembly
Grant 7,562,741 - Winklel , et al. July 21, 2
2009-07-21
Module comprising a semiconductor chip comprising a movable element
Grant 7,557,417 - Theuss , et al. July 7, 2
2009-07-07
Module Including A Micro-electro-mechanical Microphone
App 20080298621 - Theuss; Horst ;   et al.
2008-12-04
Digital camera with a transparent core disposed between a lens and a light-sensitive sensor
Grant 7,453,509 - Losehand , et al. November 18, 2
2008-11-18
Module comprising a semiconductor chip comprising a movable element
App 20080197485 - Theuss; Horst ;   et al.
2008-08-21
Rear Muffler Assembly
App 20080093161 - Winkel; Jorg ;   et al.
2008-04-24
Exhaust system
App 20070271911 - Stadler; Bernd ;   et al.
2007-11-29
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
Grant 7,221,048 - Daeche , et al. May 22, 2
2007-05-22
Roof rack for vehicles
Grant 7,108,162 - Stadler , et al. September 19, 2
2006-09-19
Chip carrier and system including a chip carrier and semiconductor chips
App 20060192296 - Auburger; Albert ;   et al.
2006-08-31
Electronic sensor device and method for producing the electronic sensor device
Grant 7,056,764 - Auburger , et al. June 6, 2
2006-06-06
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
App 20050151246 - Daeche, Frank ;   et al.
2005-07-14
Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device
Grant 6,784,551 - Auburger , et al. August 31, 2
2004-08-31
Roof rack for vehicles
App 20040124221 - Stadler, Bernd ;   et al.
2004-07-01
Digital camera with a light-sensitive sensor
App 20040095502 - Losehand, Reinhard ;   et al.
2004-05-20
Covering device for ceramic modules
Grant 6,614,661 - Gottswinter , et al. September 2, 2
2003-09-02
Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device
App 20030057446 - Auburger, Albert ;   et al.
2003-03-27
Electronic sensor device and method for producing the electronic sensor device
App 20030052702 - Auburger, Albert ;   et al.
2003-03-20
Covering device for ceramic modules
App 20020051344 - Gottswinter, Christian ;   et al.
2002-05-02
Pressure sensor component
Grant 6,313,514 - Winterer , et al. November 6, 2
2001-11-06
Handling and mounting protection device
App 20010024359 - Winterer, Jurgen ;   et al.
2001-09-27
Method of producing a pressure sensor component
App 20010002119 - Winterer, Jurgen ;   et al.
2001-05-31
Component housing for surface mounting of a semiconductor component
Grant 6,058,020 - Winterer , et al. May 2, 2
2000-05-02
Anti-buffet screen for a convertible
Grant 5,899,521 - Pfertner , et al. May 4, 1
1999-05-04

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