Stacy; Will

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stacy; Will.The latest application filed is for "substrate-free interconnected electronic mechanical structural systems".

Company Profile

5.6.6

Stacy; Will - Blacksburg VA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate-free Interconnected Electronic Mechanical Structural Systems App 20200022277 - Hovey; Ian ; et al.	2020-01-16
Structures And Methods For Interconnects And Associated Alignment And Assembly Mechanisms For And Between Chips, Components, And App 20190393580 - Rollin; Jean-Marc ; et al.	2019-12-26
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems Grant 10,361,471 - Rollin , et al.	2019-07-23
Substrate-free interconnected electronic mechanical structural systems Grant 10,257,951 - Hovey , et al.	2019-04-09
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems Grant 10,193,203 - Rollin , et al. Ja	2019-01-29
Substrate-free Interconnected Electronic Mechanical Structural Systems App 20180153055 - Hovey; Ian ; et al.	2018-05-31
Structures And Methods For Interconnects And Associated Alignment And Assembly Mechanisms For And Between Chips, Components, And 3d Systems App 20180123217 - Rollin; Jean-Marc ; et al.	2018-05-03
Substrate-free interconnected electronic mechanical structural systems Grant 9,888,600 - Hovey , et al. February 6, 2	2018-02-06
Structures And Methods For Interconnects And Associated Alignment And Assembly Mechanisms For And Between Chips, Components, And 3d Systems App 20160294035 - Rollin; Jean-Marc ; et al.	2016-10-06
Substrate-free Interconnected Electronic Mechanical Structural Systems App 20160198584 - Hovey; Ian ; et al.	2016-07-07
Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration Grant 9,306,254 - Hovey , et al. April 5, 2	2016-04-05
Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other Grant 9,306,255 - Rollin , et al. April 5, 2	2016-04-05

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