Stack; James R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Stack; James R..The latest application filed is for "structure for repairing or modifying surface connections on circuit boards".

Company Profile

0.9.7

Stack; James R. - Endicott NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure for repairing or modifying surface connections on circuit boards Grant 7,199,309 - Chamberlin , et al. April 3, 2	2007-04-03
Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board Grant 7,173,193 - Brodsky , et al. February 6, 2	2007-02-06
Structure for repairing or modifying surface connections on circuit boards App 20050239347 - Chamberlin, Bruce John ; et al.	2005-10-27
Method and structure for repairing or modifying surface connections on circuit boards Grant 6,912,780 - Chamberlin , et al. July 5, 2	2005-07-05
Method for forming a substructure of a multilayered laminate Grant 6,832,436 - Anstrom , et al. December 21, 2	2004-12-21
Method and structure for repairing or modifying surface connections on circuit boards App 20040216919 - Chamberlin, Bruce John ; et al.	2004-11-04
Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board App 20040188135 - Brodsky, William Louis ; et al.	2004-09-30
Method and structure for repairing or modifying surface connections on circuit boards Grant 6,784,377 - Chamberlin , et al. August 31, 2	2004-08-31
Printed wiring board structure with z-axis interconnections Grant 6,593,534 - Jones , et al. July 15, 2	2003-07-15
Eye prosthesis Grant 6,576,013 - Budman , et al. June 10, 2	2003-06-10
Method and structure for repairing or modifying surface connections on circuit boards App 20020179324 - Chamberlin, Bruce John ; et al.	2002-12-05
Land grid array (LGA) pad repair structure and method App 20020166696 - Chamberlin, Bruce J. ; et al.	2002-11-14
Printed wiring board structure with z-axis interconnections App 20020131229 - Jones, Gerald W. ; et al.	2002-09-19
Conductive substructures of a multilayered laminate App 20020100613 - Anstrom, Donald O. ; et al.	2002-08-01
Peripheral power board structure Grant 6,426,466 - Chamberlin , et al. July 30, 2	2002-07-30
Conductive substructures of a multilayered laminate Grant 6,407,341 - Anstrom , et al. June 18, 2	2002-06-18

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