STACK DEVICES CORP.
Patent Applications and Registrations
Patent applications and USPTO patent grants for STACK DEVICES CORP..The latest application filed is for "method of package for sensor chip".
- STACK DEVICES CORP. - Miaoli TW
- STACK DEVICES CORP. - Chunan Miaoli TW
- STACK DEVICES Corp. - Miaoli County TW
| Patent | Date |
|---|---|
| Method Of Package For Sensor Chip App 20150214416 - HO; Mon-Nan ; et al. | 2015-07-30 |
| Sensor Chip Protective Image Sensor Packaging Method App 20140170797 - HO; Mon-Nan ; et al. | 2014-06-19 |
| Image Sensor Packaging Method App 20140170796 - HO; Mon-Nan ; et al. | 2014-06-19 |
| Method of fabricating stacked semiconductor device App 20050255632 - Biar, Jin-Chyung ; et al. | 2005-11-17 |
| Stacked semiconductor device App 20050224944 - Biar, Jin-Chyung ; et al. | 2005-10-13 |
| Stacked semiconductor device having mask mounted in between stacked dies App 20050173784 - Bai, Jin-Chung ; et al. | 2005-08-11 |
| Stacked semiconductor device App 20050167810 - Bai, Jin-Chung ; et al. | 2005-08-04 |
| Image capture device Grant 6,900,429 - Bai , et al. May 31, 2 | 2005-05-31 |
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