Staab; Paul C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Staab; Paul C..The latest application filed is for "method for integrated circuit packaging".
- Staab; Paul C. - Carmel IN
- Staab; Paul C. - Akron OH
| Patent | Date |
|---|---|
| Press-fit IC power package and method therefor Grant 6,476,480 - Staab , et al. November 5, 2 | 2002-11-05 |
| Method for integrated circuit packaging App 20020145181 - Myer, Ronald D. ; et al. | 2002-10-10 |
| High performance tire and tread compound for it Grant 4,644,988 - Ahmad , et al. February 24, 1 | 1987-02-24 |
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