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name:-0.0055561065673828
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St.John, Frank Patent Filings

St.John, Frank

Patent Applications and Registrations

Patent applications and USPTO patent grants for St.John, Frank.The latest application filed is for "method of making heat-shrinkable emi/rfi shielding material".

Company Profile
0.5.3
  • St.John, Frank - Rockford IL
  • St. John; Frank - Patterson NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of making heat-shrinkable EMI/RFI shielding material
App 20050202158 - Millas, Emil ;   et al.
2005-09-15
Heat-Shrinkable EMI/RFI shielding material
Grant 6,881,904 - Millas , et al. April 19, 2
2005-04-19
Adhesive interconnector
App 20040077189 - St. John, Frank ;   et al.
2004-04-22
Printed wiring board conductive via hole filler having metal oxide reducing capability
Grant 6,692,664 - St. John February 17, 2
2004-02-17
Heat-shrinkable EMI/RFI shielding material
App 20030186602 - Millas, Emil ;   et al.
2003-10-02
Printed wiring board conductive via hole filler having metal oxide reducing capability
Grant 6,337,037 - St. John January 8, 2
2002-01-08
Solderable conductive compositions having high adhesive strength
Grant 4,595,606 - St. John , et al. June 17, 1
1986-06-17
Solderable polymer thick films
Grant 4,548,879 - St. John , et al. October 22, 1
1985-10-22

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