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Patent applications and USPTO patent grants for St.John, Frank.The latest application filed is for "method of making heat-shrinkable emi/rfi shielding material".
Patent | Date |
---|---|
Method of making heat-shrinkable EMI/RFI shielding material App 20050202158 - Millas, Emil ;   et al. | 2005-09-15 |
Heat-Shrinkable EMI/RFI shielding material Grant 6,881,904 - Millas , et al. April 19, 2 | 2005-04-19 |
Adhesive interconnector App 20040077189 - St. John, Frank ;   et al. | 2004-04-22 |
Printed wiring board conductive via hole filler having metal oxide reducing capability Grant 6,692,664 - St. John February 17, 2 | 2004-02-17 |
Heat-shrinkable EMI/RFI shielding material App 20030186602 - Millas, Emil ;   et al. | 2003-10-02 |
Printed wiring board conductive via hole filler having metal oxide reducing capability Grant 6,337,037 - St. John January 8, 2 | 2002-01-08 |
Solderable conductive compositions having high adhesive strength Grant 4,595,606 - St. John , et al. June 17, 1 | 1986-06-17 |
Solderable polymer thick films Grant 4,548,879 - St. John , et al. October 22, 1 | 1985-10-22 |
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