ST. GERMAIN; Stephen
Patent Applications and Registrations
Patent applications and USPTO patent grants for ST. GERMAIN; Stephen.The latest application filed is for "semiconductor device and method for supporting ultra-thin semiconductor die".
Company Profile
5.36.34
- ST. GERMAIN; Stephen - Gilbert AZ
- St. Germain; Stephen - Scottsdale AZ
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor Device And Method For Supporting Ultra-thin Semiconductor Die App 20220262633 - GRIVNA; Gordon M. ; et al. | 2022-08-18 |
| Structure And Method Related To A Power Module Using A Hybrid Spacer App 20220208637 - CHEN; Liangbiao ; et al. | 2022-06-30 |
| Semiconductor device and method for supporting ultra-thin semiconductor die Grant 11,355,341 - Grivna , et al. June 7, 2 | 2022-06-07 |
| Reducing Stress Cracks In Substrates App 20220173049 - LIU; Yong ; et al. | 2022-06-02 |
| Structure and method related to a power module using a hybrid spacer Grant 11,282,764 - Chen , et al. March 22, 2 | 2022-03-22 |
| Semiconductor Package Structures And Methods Of Manufacture App 20220084920 - ST. GERMAIN; Stephen ; et al. | 2022-03-17 |
| Semiconductor package structures and methods of manufacture Grant 11,217,515 - St. Germain , et al. January 4, 2 | 2022-01-04 |
| Packaging structure for gallium nitride devices Grant 11,107,753 - St. Germain , et al. August 31, 2 | 2021-08-31 |
| Structure And Method Related To A Power Module Using A Hybrid Spacer App 20210249329 - CHEN; Liangbiao ; et al. | 2021-08-12 |
| Low Stress Asymmetric Dual Side Module App 20210035956 - CHEW; Chee Hiong ; et al. | 2021-02-04 |
| Low Stress Asymmetric Dual Side Module App 20210035892 - CHEW; Chee Hiong ; et al. | 2021-02-04 |
| Semiconductor Device And Method For Supporting Ultra-thin Semiconductor Die App 20200258739 - A1 | 2020-08-13 |
| Semiconductor device and method for supporting ultra-thin semiconductor die Grant 10,672,607 - Grivna , et al. | 2020-06-02 |
| Packaging Structure For Gallium Nitride Devices App 20200168529 - ST. GERMAIN; Stephen ; et al. | 2020-05-28 |
| Single or multi chip module package and related methods Grant 10,522,448 - St. Germain , et al. Dec | 2019-12-31 |
| Semiconductor Package Structures And Methods Of Manufacture App 20190385939 - ST. GERMAIN; Stephen ; et al. | 2019-12-19 |
| Semiconductor devices and methods of making the same Grant 10,490,488 - Arbuthnot , et al. Nov | 2019-11-26 |
| Semiconductor Devices And Methods Of Making The Same App 20190326202 - ARBUTHNOT; Roger M. ; et al. | 2019-10-24 |
| Semiconductor devices and methods of making the same Grant 10,325,835 - Arbuthnot , et al. | 2019-06-18 |
| Semiconductor Device And Method For Supporting Ultra-thin Semiconductor Die App 20190035687 - GRIVNA; Gordon M. ; et al. | 2019-01-31 |
| Semiconductor device and method for supporting ultra-thin semiconductor die Grant 10,090,199 - Grivna , et al. October 2, 2 | 2018-10-02 |
| Semiconductor Device And Method For Supporting Ultra-thin Semiconductor Die App 20180254217 - GRIVNA; Gordon M. ; et al. | 2018-09-06 |
| Semiconductor Devices And Methods Of Making The Same App 20180138109 - Arbuthnot; Roger M. ; et al. | 2018-05-17 |
| Single Or Multi Chip Module Package And Related Methods App 20180096925 - St. Germain; Stephen ; et al. | 2018-04-05 |
| Holes and dimples to control solder flow Grant 9,911,684 - St. Germain , et al. March 6, 2 | 2018-03-06 |
| Holes And Dimples To Control Solder Flow App 20180053712 - ST. GERMAIN; Stephen ; et al. | 2018-02-22 |
| Single or multi chip module package and related methods Grant 9,870,986 - St. Germain , et al. January 16, 2 | 2018-01-16 |
| Half-bridge HEMT circuit and an electronic package including the circuit Grant 9,773,895 - Padmanabhan , et al. September 26, 2 | 2017-09-26 |
| Semiconductor Devices And Methods Of Making The Same App 20170141017 - Arbuthnot; Roger M. ; et al. | 2017-05-18 |
| Semiconductor package for a lateral device and related methods Grant 9,646,919 - St. Germain , et al. May 9, 2 | 2017-05-09 |
| Single Or Multi Chip Module Package And Related Methods App 20170110391 - ST. GERMAIN; Stephen ; et al. | 2017-04-20 |
| Semiconductor devices and methods of making the same Grant 9,576,883 - Arbuthnot , et al. February 21, 2 | 2017-02-21 |
| Single or multi chip module package and related methods Grant 9,558,968 - St. Germain , et al. January 31, 2 | 2017-01-31 |
| Half-bridge Hemt Circuit And An Electronic Package Including The Circuit App 20160322969 - PADMANABHAN; Balaji ; et al. | 2016-11-03 |
| Semiconductor Devices And Methods Of Making The Same App 20160315032 - Arbuthnot; Roger M. ; et al. | 2016-10-27 |
| Semiconductor Package For A Lateral Device And Related Methods App 20160276250 - ST. GERMAIN; Stephen ; et al. | 2016-09-22 |
| Semiconductor devices and methods of making the same Grant 9,397,028 - Arbuthnot , et al. July 19, 2 | 2016-07-19 |
| Semiconductor package for a lateral device and related methods Grant 9,379,193 - St. Germain , et al. June 28, 2 | 2016-06-28 |
| Single Or Multi Chip Module Package And Related Methods App 20160079095 - St. Germain; Stephen ; et al. | 2016-03-17 |
| Semiconductor Package For A Lateral Device And Related Methods App 20160043189 - St. Germain; Stephen ; et al. | 2016-02-11 |
| Semiconductor Devices And Methods Of Making The Same App 20150270196 - Arbuthnot; Roger M. ; et al. | 2015-09-24 |
| Semiconductor devices and methods of making the same Grant 9,070,721 - Arbuthnot , et al. June 30, 2 | 2015-06-30 |
| Semiconductor package Grant 8,384,206 - St. Germain , et al. February 26, 2 | 2013-02-26 |
| Multi-chip semiconductor connector Grant 8,253,239 - Carney , et al. August 28, 2 | 2012-08-28 |
| Semiconductor Package App 20110169152 - St. Germain; Stephen ; et al. | 2011-07-14 |
| Method of forming a semiconductor package and structure therefor Grant 7,935,575 - St. Germain , et al. May 3, 2 | 2011-05-03 |
| Multi-chip Semiconductor Connector App 20110068451 - Carney; Francis J. ; et al. | 2011-03-24 |
| Multi-chip semiconductor connector and method Grant 7,875,964 - Carney , et al. January 25, 2 | 2011-01-25 |
| Method Of Forming A Semiconductor Package And Structure Therefor App 20090250794 - ST. GERMAIN; STEPHEN ; et al. | 2009-10-08 |
| Semiconductor package structure for vertical mount and method Grant 7,566,967 - St. Germain , et al. July 28, 2 | 2009-07-28 |
| Multi-chip semiconductor connector assembly method Grant 7,498,195 - Carney , et al. March 3, 2 | 2009-03-03 |
| Semiconductor package structure having multiple heat dissipation paths and method of manufacture Grant 7,495,323 - St. Germain , et al. February 24, 2 | 2009-02-24 |
| Encapsulated electronic device Grant 7,476,959 - St. Germain , et al. January 13, 2 | 2009-01-13 |
| Semiconductor package structure for vertical mount and method Grant 7,397,120 - St. Germain , et al. July 8, 2 | 2008-07-08 |
| Semiconductor Package Structure For Vertical Mount And Method App 20080111227 - St. Germain; Stephen ; et al. | 2008-05-15 |
| Encapsulated electronic device structure Grant 7,319,266 - St. Germain , et al. January 15, 2 | 2008-01-15 |
| Multi-chip Semiconductor Connector Assemblies App 20080006920 - Carney; Francis J. ; et al. | 2008-01-10 |
| Method For Forming An Encapsulated Device And Structure App 20070278700 - ST. GERMAIN; Stephen ; et al. | 2007-12-06 |
| Multi-chip semiconductor connector assemblies Grant 7,298,034 - Carney , et al. November 20, 2 | 2007-11-20 |
| Multi-chip Semiconductor Connector And Method App 20070126106 - Carney; Francis J. ; et al. | 2007-06-07 |
| Multi-chip semiconductor connector and method Grant 7,202,106 - Carney , et al. April 10, 2 | 2007-04-10 |
| Multi-chip semiconductor connector assembly method Grant 7,202,105 - Carney , et al. April 10, 2 | 2007-04-10 |
| Robust power semiconductor package Grant 7,135,761 - Carney , et al. November 14, 2 | 2006-11-14 |
| Robust power semiconductor package App 20060055011 - Carney; Francis J. ; et al. | 2006-03-16 |
| Multi-chip semiconductor connector and method App 20050285235 - Carney, Francis J. ; et al. | 2005-12-29 |
| Integrated circuit and laminated leadframe package Grant 6,747,341 - Knapp , et al. June 8, 2 | 2004-06-08 |
| Semiconductor device and laminated leadframe package Grant 6,713,317 - Knapp , et al. March 30, 2 | 2004-03-30 |
| Integrated Circuit And Laminated Leadframe Package App 20040029312 - Knapp, James ; et al. | 2004-02-12 |
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