| Patent | Date |
|---|
Semiconductor package with heat sink
Grant 7,446,408 - Shim , et al. November 4, 2 | 2008-11-04 |
Ground plane for exposed package
Grant 6,876,069 - Punzalan , et al. April 5, 2 | 2005-04-05 |
Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same
Grant 6,875,634 - Shim , et al. April 5, 2 | 2005-04-05 |
Leadframe for die stacking applications and related die stacking concepts
Grant 6,841,858 - Shim , et al. January 11, 2 | 2005-01-11 |
PBGA singulated substrate for model melamine cleaning
Grant 6,834,658 - Cantillep December 28, 2 | 2004-12-28 |
Enhanced BGA grounded heatsink
Grant 6,828,671 - Aquien , et al. December 7, 2 | 2004-12-07 |
Mold cap anchoring method for molded flex BGA packages
Grant 6,825,067 - Ararao , et al. November 30, 2 | 2004-11-30 |
Heat spreader interconnect for thermally enhanced PBGA packages
Grant 6,818,981 - Shim , et al. November 16, 2 | 2004-11-16 |
Cost effective substrate fabrication for flip-chip packages
Grant 6,802,445 - Shim , et al. October 12, 2 | 2004-10-12 |
Torch Bump
App 20040178503 - Jin, Yong Gang ; et al. | 2004-09-16 |
Testing of BGA and other CSP packages using probing techniques
Grant 6,791,346 - Mehta , et al. September 14, 2 | 2004-09-14 |
Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration
Grant 6,774,640 - Li August 10, 2 | 2004-08-10 |
Multi-package conversion kit for a pick and place handler
App 20040134054 - Sum, Kai Wah ; et al. | 2004-07-15 |
Mold cap anchoring method for molded flex BGA packages
App 20040108601 - Ararao, Virgil C. ; et al. | 2004-06-10 |
Method of forming a small pitch torch bump for mounting high-performance flip-flop devices
Grant 6,740,577 - Jin , et al. May 25, 2 | 2004-05-25 |
Cost effective substrate fabrication for flip-chip packages
App 20040079788 - Shim, Il Kwon ; et al. | 2004-04-29 |
Ground plane for exposed package
App 20040070055 - Punzalan, Jeffrey D. ; et al. | 2004-04-15 |
Multi-package conversion kit for a pick and place handler
Grant 6,718,608 - Wah , et al. April 13, 2 | 2004-04-13 |
Leadframe for die stacking applications and related die stacking concepts
App 20040061202 - Shim, Il Kwon ; et al. | 2004-04-01 |
Enhanced chip scale package for wire bond dies
Grant 6,710,438 - Yeo , et al. March 23, 2 | 2004-03-23 |
Heat spreader interconnect methodology for thermally enhanced PBGA packages
Grant 6,706,563 - Shim , et al. March 16, 2 | 2004-03-16 |
Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration
App 20040036068 - Li, Jian-Jun | 2004-02-26 |
Flip chip molded/exposed die process and package structure
Grant 6,660,565 - Briar December 9, 2 | 2003-12-09 |
PBGA substrate for anchoring heat sink
App 20030216024 - Shim, Il Kwon ; et al. | 2003-11-20 |
Heat spreader interconnect methodology for thermally enhanced PBGA packages
App 20030197195 - Shim, Il Kwon ; et al. | 2003-10-23 |
Ground Plane For Exposed Package
App 20030160309 - Punzalan, Jeffrey D. ; et al. | 2003-08-28 |
Single unit automated assembly of flex enhanced ball grid array packages
App 20030151148 - Camenforte, Raymundo M. ; et al. | 2003-08-14 |
Multi-package conversion kit for a pick and place handler
App 20030140475 - Wah, Sum Kai ; et al. | 2003-07-31 |
Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same
App 20030138994 - Shim, Il Kwon ; et al. | 2003-07-24 |
PBGA substrate for anchoring heat sink
App 20030057545 - Shim, IL Kwon ; et al. | 2003-03-27 |
PBGA singulated substrate for model melamine cleaning
App 20030024548 - Cantillep, Loreto Ycong | 2003-02-06 |
Semi-automated probe bender
App 20030015013 - Lee, Chong Meng | 2003-01-23 |
Super thin/super thermal ball grid array package
App 20020180040 - Camenforte, Raymundo M. ; et al. | 2002-12-05 |
Enhanced BGA grounded heatsink
App 20020163064 - Aquien, Weddie ; et al. | 2002-11-07 |
Robust universal docking system
App 20020145438 - Ramesh, Ramamoorthi ; et al. | 2002-10-10 |
Testing of BGA and other CSP packages using probing techniques
App 20020125908 - Mehta, Rajiv ; et al. | 2002-09-12 |
Testing of BGA and other CSP packages using probing techniques
App 20020125909 - Mehta, Rajiv ; et al. | 2002-09-12 |
Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages
Grant 6,432,742 - Guan , et al. August 13, 2 | 2002-08-13 |
Process carrier for flexible substrates
App 20020093080 - Kay, Yuen Yew | 2002-07-18 |
Heat spreader hole pin 1 identifier
App 20020093095 - Aquien, Weddie Pacio ; et al. | 2002-07-18 |
Heat spreader hole pin 1 identifier
Grant 6,403,401 - Aquien , et al. June 11, 2 | 2002-06-11 |
Disposable mold runner gate for substrate based electronic packages
App 20020056893 - Briar, John | 2002-05-16 |
Molded stiffener for flexible circuit molding
App 20020056570 - Briar, John ; et al. | 2002-05-16 |
Die paddle enhancement for exposed pad in semiconductor packaging
Grant 6,380,048 - Boon , et al. April 30, 2 | 2002-04-30 |
Disposable mold runner gate for substrate based electronic packages
Grant 6,372,553 - Briar April 16, 2 | 2002-04-16 |
Boat and assembly method for ball grid array packages
App 20020041024 - Cantillep, Loreto Yeong ; et al. | 2002-04-11 |
Boat and assembly method for ball grid array packages
Grant 6,359,336 - Cantillep , et al. March 19, 2 | 2002-03-19 |
Method of molding flexible circuit with molded stiffener
Grant 6,355,199 - Briar , et al. March 12, 2 | 2002-03-12 |
Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
Grant 6,300,781 - Yap , et al. October 9, 2 | 2001-10-09 |
Flip chip thermally enhanced ball grid array
App 20010026955 - Briar, John | 2001-10-04 |
Multi air-knife box and method of use
Grant 6,282,812 - Wee , et al. September 4, 2 | 2001-09-04 |
Extended lead package
App 20010002320 - Zhang, Tonglong ; et al. | 2001-05-31 |
Contactor sleeve assembly for a pick and place semiconductor device handler
Grant 6,184,047 - Shekar , et al. February 6, 2 | 2001-02-06 |
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