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name:-0.0094380378723145
name:-0.00058102607727051
ST Assembly Test Service Ltd. Patent Filings

ST Assembly Test Service Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for ST Assembly Test Service Ltd..The latest application filed is for "integrated circuit package with keep-out zone overlapping undercut zone".

Company Profile
0.6.2
  • ST Assembly Test Service Ltd. - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integrated circuit package with keep-out zone overlapping undercut zone
App 20050194698 - Shim, Il Kwon ;   et al.
2005-09-08
Semiconductor packages and leadframe assemblies
App 20050087846 - Han, Byung Joon ;   et al.
2005-04-28
Ground plane for exposed package
Grant 6,630,373 - Punzalan , et al. October 7, 2
2003-10-07
Thermally enhanced stacked die package
Grant 6,627,990 - Shim , et al. September 30, 2
2003-09-30
PBGA substrate for anchoring heat sink
Grant 6,599,779 - Shim , et al. July 29, 2
2003-07-29
Ground land for singulated ball grid array
Grant 6,597,188 - Reynoso , et al. July 22, 2
2003-07-22
Process and support carrier for flexible substrates
Grant 6,581,278 - Kay June 24, 2
2003-06-24
Single unit automated assembly of flex enhanced ball grid array packages
Grant 6,544,812 - Camenforte , et al. April 8, 2
2003-04-08

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