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Patent applications and USPTO patent grants for ST Assembly Test Service Ltd..The latest application filed is for "integrated circuit package with keep-out zone overlapping undercut zone".
Patent | Date |
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Integrated circuit package with keep-out zone overlapping undercut zone App 20050194698 - Shim, Il Kwon ;   et al. | 2005-09-08 |
Semiconductor packages and leadframe assemblies App 20050087846 - Han, Byung Joon ;   et al. | 2005-04-28 |
Ground plane for exposed package Grant 6,630,373 - Punzalan , et al. October 7, 2 | 2003-10-07 |
Thermally enhanced stacked die package Grant 6,627,990 - Shim , et al. September 30, 2 | 2003-09-30 |
PBGA substrate for anchoring heat sink Grant 6,599,779 - Shim , et al. July 29, 2 | 2003-07-29 |
Ground land for singulated ball grid array Grant 6,597,188 - Reynoso , et al. July 22, 2 | 2003-07-22 |
Process and support carrier for flexible substrates Grant 6,581,278 - Kay June 24, 2 | 2003-06-24 |
Single unit automated assembly of flex enhanced ball grid array packages Grant 6,544,812 - Camenforte , et al. April 8, 2 | 2003-04-08 |
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