St. Amand; Roger D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for St. Amand; Roger D..The latest application filed is for "semiconductor devices and methods of manufacturing semiconductor devices".
- St. Amand; Roger D. - Tempe AZ
| Patent | Date |
|---|---|
| Semiconductor devices and methods of manufacturing semiconductor devices Grant 11,362,027 - St. Amand , et al. June 14, 2 | 2022-06-14 |
| Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20210272887 - St. Amand; Roger D. ; et al. | 2021-09-02 |
| Methods And Structures For Increasing The Allowable Die Size In Tmv Packages App 20210166992 - Nicholls; Louis W. ; et al. | 2021-06-03 |
| Thin Bonded Interposer Package App 20210111151 - Berry; Christopher J. ; et al. | 2021-04-15 |
| Thin bonded interposer package Grant 10,818,637 - Berry , et al. October 27, 2 | 2020-10-27 |
| Semiconductor devices and methods of making semiconductor devices Grant 10,714,408 - Nicholls , et al. | 2020-07-14 |
| Methods And Structures For Increasing The Allowable Die Size In Tmv Packages App 20190371706 - Nicholls; Louis W. ; et al. | 2019-12-05 |
| Thin Bonded Interposer Package App 20190348395 - Berry; Christopher J. ; et al. | 2019-11-14 |
| Methods and structures for increasing the allowable die size in TMV packages Grant 10,347,562 - Nicholls , et al. July 9, 2 | 2019-07-09 |
| Thin bonded interposer package Grant 10,242,966 - Berry , et al. | 2019-03-26 |
| Methods and structures for increasing the allowable die size in TMV packages Grant 9,721,872 - Nicholls , et al. August 1, 2 | 2017-08-01 |
| Thin bonded interposer package Grant 9,711,485 - Berry , et al. July 18, 2 | 2017-07-18 |
| Stackable package and method Grant 9,496,210 - Darveaux , et al. November 15, 2 | 2016-11-15 |
| Thin Sandwich Embedded Package App 20150221570 - Berry; Christopher J. ; et al. | 2015-08-06 |
| Column and stacking balls package fabrication method and structure Grant 8,890,337 - St. Amand November 18, 2 | 2014-11-18 |
| Stacked inverted flip chip package and fabrication method Grant 8,836,115 - St. Amand , et al. September 16, 2 | 2014-09-16 |
| Fan out build up substrate stackable package and method Grant 8,796,561 - Scanlan , et al. August 5, 2 | 2014-08-05 |
| Flip chip bump structure and fabrication method Grant 8,704,369 - Huemoeller , et al. April 22, 2 | 2014-04-22 |
| Underfill contacting stacking balls package fabrication method and structure Grant 8,633,598 - St. Amand January 21, 2 | 2014-01-21 |
| Package in package device for RF transceiver module Grant 8,558,365 - Roa , et al. October 15, 2 | 2013-10-15 |
| Stackable package and method Grant 8,482,134 - Darveaux , et al. July 9, 2 | 2013-07-09 |
| Flip chip bump structure and fabrication method Grant 8,390,116 - Huemoeller , et al. March 5, 2 | 2013-03-05 |
| Shielding for a semiconductor package Grant 8,129,824 - St. Amand , et al. March 6, 2 | 2012-03-06 |
| Semiconductor package with fast power-up cycle and method of making same Grant 8,084,868 - St. Amand , et al. December 27, 2 | 2011-12-27 |
| Stacked electronic component package having film-on-wire spacer Grant 8,072,083 - St. Amand , et al. December 6, 2 | 2011-12-06 |
| Package in package device for RF transceiver module Grant 8,058,715 - Roa , et al. November 15, 2 | 2011-11-15 |
| Flip chip bump structure and fabrication method Grant 7,932,170 - Huemoeller , et al. April 26, 2 | 2011-04-26 |
| Stacked flip chip die assembly Grant 7,859,119 - St. Amand , et al. December 28, 2 | 2010-12-28 |
| Semiconductor package with fast power-up cycle and method of making same Grant 7,768,135 - St. Amand , et al. August 3, 2 | 2010-08-03 |
| Die-mounting substrate and method incorporating dummy traces for improving mounting film planarity Grant 7,755,176 - St. Amand , et al. July 13, 2 | 2010-07-13 |
| Stacked electronic component package having film-on-wire spacer Grant 7,675,180 - St. Amand , et al. March 9, 2 | 2010-03-09 |
| Stacked die assembly having semiconductor die projecting beyond support Grant 7,459,776 - St. Amand , et al. December 2, 2 | 2008-12-02 |
| Stacked electronic component package having single-sided film spacer App 20080237824 - St. Amand; Roger D. ; et al. | 2008-10-02 |
| Stacked die assembly having semiconductor die overhanging support Grant 7,132,753 - St. Amand , et al. November 7, 2 | 2006-11-07 |
| Stacked-die extension support structure and method thereof Grant 7,071,568 - St. Amand , et al. July 4, 2 | 2006-07-04 |
| Stacked semiconductor die assembly having at least one support Grant 6,930,378 - St. Amand , et al. August 16, 2 | 2005-08-16 |
| Wireless control and/or data acquisition system in an integrated circuit package App 20030060185 - Fisher, Richard J. ; et al. | 2003-03-27 |
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