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Patent applications and USPTO patent grants for Srivastava; Anuranjan.The latest application filed is for "wafer-based electronic component packaging".
Patent | Date |
---|---|
Wafer-based electronic component packaging Grant 10,211,172 - Srivastava , et al. Feb | 2019-02-19 |
Semiconductor device having trench capacitor structure integrated therein Grant 9,608,130 - Tran , et al. March 28, 2 | 2017-03-28 |
Semiconductor device having capacitor integrated therein Grant 9,520,462 - Tran , et al. December 13, 2 | 2016-12-13 |
Semiconductor device having capacitor integrated therein Grant 9,196,672 - Tran , et al. November 24, 2 | 2015-11-24 |
Wafer-based Electronic Component Packaging App 20150262944 - Srivastava; Anuranjan ;   et al. | 2015-09-17 |
Semiconductor Device Having Capacitor Integrated Therein App 20130175666 - Tran; Khanh ;   et al. | 2013-07-11 |
Semiconductor Device Having Trench Capacitor Structure Integrated Therein App 20130161792 - Tran; Khanh ;   et al. | 2013-06-27 |
Transient enhanced atomic layer deposition Grant 7,981,473 - Kim , et al. July 19, 2 | 2011-07-19 |
Transient enhanced atomic layer deposition App 20080131601 - Kim; Gi Youl ;   et al. | 2008-06-05 |
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