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Controlling the morphology in metal loaded paste material
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Bonded stacked wafers and methods of electroplating bonded stacked wafers
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Methods of forming coaxial feedthroughs for 3D integrated circuits
Grant 9,184,113 - Sridhar , et al. November 10, 2 | 2015-11-10 |
Bonded Stacked Wafers And Methods Of Electroplating Bonded Stacked Wafers
App 20150132891 - Zou; Quanbo ; et al. | 2015-05-14 |
High rate deposition method of magnetic nanocomposites
Grant 9,023,422 - Sridhar , et al. May 5, 2 | 2015-05-05 |
Bonded stacked wafers and methods of electroplating bonded stacked wafers
Grant 8,970,043 - Zou , et al. March 3, 2 | 2015-03-03 |
Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filters
Grant 8,952,768 - Godshalk , et al. February 10, 2 | 2015-02-10 |
Methods of forming coaxial feedthroughs for 3D integrated circuits
Grant 8,940,631 - Sridhar , et al. January 27, 2 | 2015-01-27 |
Magnetic Device Utilizing Nanocomposite Films Layered With Adhesives
App 20140347157 - Pulugurtha; Markondeya Raj ; et al. | 2014-11-27 |
3D chip package with shielded structures
Grant 8,686,543 - Bergemont , et al. April 1, 2 | 2014-04-01 |
Optimal Acoustic Impedance Materials for Polished Substrate Coating to Suppress Passband Ripple in BAW Resonators and Filters
App 20130335169 - Godshalk; Edward Martin ; et al. | 2013-12-19 |
Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filters
Grant 8,512,800 - Godshalk , et al. August 20, 2 | 2013-08-20 |
3d Chip Package With Shielded Structures
App 20130105950 - Bergemont; Albert ; et al. | 2013-05-02 |
Bonded Stacked Wafers And Methods Of Electroplating Bonded Stacked Wafers
App 20120193808 - Zou; Quanbo ; et al. | 2012-08-02 |
Preventing Contact Stiction In Micro Relays
App 20120194306 - Sridhar; Uppili ; et al. | 2012-08-02 |
Bonded wafer package module
Grant 7,863,699 - Dropmann , et al. January 4, 2 | 2011-01-04 |
Bonded Wafer Package Module
App 20090289722 - Dropmann; Hans ; et al. | 2009-11-26 |
Optimal Acoustic Impedance Materials for Polished Substrate Coating to Suppress Passband Ripple in BAW Resonators and Filters
App 20090142480 - Godshalk; Edward Martin ; et al. | 2009-06-04 |
Microrelays and microrelay fabrication and operating methods
Grant 7,463,125 - Sridhar , et al. December 9, 2 | 2008-12-09 |
Wafer level packaging process
Grant 7,393,758 - Sridhar , et al. July 1, 2 | 2008-07-01 |
Wafer level packaging process
App 20070099395 - Sridhar; Uppili ; et al. | 2007-05-03 |
Titanium-tungsten alloy based mirrors and electrodes in bulk acoustic wave devices
App 20070035364 - Sridhar; Uppili ; et al. | 2007-02-15 |
Method of making an integrated circuit inductor wherein a plurality of apertures are formed beneath an inductive loop
Grant 6,908,825 - Xu , et al. June 21, 2 | 2005-06-21 |
Microrelays and microrelay fabrication and operating methods
App 20050121298 - Sridhar, Uppili ; et al. | 2005-06-09 |
Method of fabricating micro-mirror switching device
Grant 6,858,459 - Singh , et al. February 22, 2 | 2005-02-22 |
Microrelays and microrelay fabrication and operating methods
Grant 6,841,839 - Sridhar , et al. January 11, 2 | 2005-01-11 |
Micro-relay
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Miniaturized multi-chamber thermal cycler for independent thermal multiplexing
Grant 6,762,049 - Zou , et al. July 13, 2 | 2004-07-13 |
Microrelays and microrelay fabrication and operating methods
App 20040056320 - Sridhar, Uppili ; et al. | 2004-03-25 |
Z-axis accelerometer
Grant 6,662,654 - Miao , et al. December 16, 2 | 2003-12-16 |
Method Of Fabricating Micro-mirror Switching Device
App 20030218227 - Singh, Janak ; et al. | 2003-11-27 |
Z-axis Accelerometer
App 20030209076 - Miao, Yubo ; et al. | 2003-11-13 |
Microrelays and microrelay fabrication and operating methods
Grant 6,621,135 - Sridhar , et al. September 16, 2 | 2003-09-16 |
Method of making an integrated circuit inductor
App 20030071325 - Xu, Shuming ; et al. | 2003-04-17 |
Miniaturized thermal cycler
Grant 6,521,447 - Zou , et al. February 18, 2 | 2003-02-18 |
Miniaturized thermal cycler
Grant 6,509,186 - Zou , et al. January 21, 2 | 2003-01-21 |
Miniaturized multi-chamber thermal cycler for independent thermal multiplexing
App 20030008286 - Zou, Quanbo ; et al. | 2003-01-09 |
Room temperature wafer-to-wafer bonding by polydimethylsiloxane
Grant 6,503,847 - Chen , et al. January 7, 2 | 2003-01-07 |
Miniaturized thermal cycler
App 20020173032 - Zou, Quanbo ; et al. | 2002-11-21 |
Room temperature wafer-to-wafer bonding by polydimethylsiloxane
App 20020160582 - Chen, Yu ; et al. | 2002-10-31 |
Lateral polysilicon beam process
Grant 6,461,888 - Sridhar , et al. October 8, 2 | 2002-10-08 |
Method to prevent charging effects in electrostatic devices
App 20020121838 - Samper, Victor Donald ; et al. | 2002-09-05 |
Miniaturized Thermal Cycler
App 20020115200 - Zou, Quanbo ; et al. | 2002-08-22 |
Miniaturized thermal cycler
Grant 6,432,695 - Zou , et al. August 13, 2 | 2002-08-13 |
Integrated circuit inductor
App 20010045617 - Xu, Shuming ; et al. | 2001-11-29 |
Offset pressure sensor
Grant 5,412,994 - Cook , et al. May 9, 1 | 1995-05-09 |
Adhesion layer for platinum based sensors
Grant 4,952,904 - Johnson , et al. August 28, 1 | 1990-08-28 |
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