Spurlin; Tighe A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Spurlin; Tighe A..The latest application filed is for "electrodeposition of cobalt tungsten films".

Company Profile

8.10.23

Spurlin; Tighe A. - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrodeposition Of Cobalt Tungsten Films App 20220102209 - Spurlin; Tighe A. ; et al.	2022-03-31
Removal of electroplating bath additives Grant 11,280,022 - Spurlin , et al. March 22, 2	2022-03-22
Monitoring surface oxide on seed layers during electroplating Grant 11,208,732 - Huang , et al. December 28, 2	2021-12-28
Removal Of Electroplating Bath Additives App 20200308724 - Spurlin; Tighe A. ; et al.	2020-10-01
Configuration and method of operation of an electrodeposition system for improved process stability and performance Grant 10,745,817 - Ganesan , et al. A	2020-08-18
Removal of electroplating bath additives Grant 10,711,366 - Spurlin , et al.	2020-07-14
Monitoring Surface Oxide On Seed Layers During Electroplating App 20190390361 - Huang; Ludan ; et al.	2019-12-26
Monitoring surface oxide on seed layers during electroplating Grant 10,443,146 - Huang , et al. Oc	2019-10-15
Removal Of Electroplating Bath Additives App 20190203375 - Spurlin; Tighe A. ; et al.	2019-07-04
Method And Apparatus For Remote Plasma Treatment For Reducing Metal Oxides On A Metal Seed Layer App 20180350670 - Spurlin; Tighe A. ; et al.	2018-12-06
Monitoring Surface Oxide On Seed Layers During Electroplating App 20180282894 - Huang; Ludan ; et al.	2018-10-04
Configuration And Method Of Operation Of An Electrodeposition System For Improved Process Stability And Performance App 20180038007 - Ganesan; Kousik ; et al.	2018-02-08
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte App 20180030611 - Spurlin; Tighe A. ; et al.	2018-02-01
Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer Grant 9,865,501 - Spurlin , et al. January 9, 2	2018-01-09
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte Grant 9,816,196 - Spurlin , et al. November 14, 2	2017-11-14
Method and apparatus for characterizing metal oxide reduction Grant 9,472,377 - Opocensky , et al. October 18, 2	2016-10-18
Current ramping and current pulsing entry of substrates for electroplating Grant 9,385,035 - Spurlin , et al. July 5, 2	2016-07-05
Method And Apparatus For Characterizing Metal Oxide Reduction App 20160111342 - Huang; Ludan ; et al.	2016-04-21
Method And Apparatus For Characterizing Metal Oxide Reduction App 20160111344 - Opocensky; Edward C. ; et al.	2016-04-21
Atmospheric Plasma Apparatus For Semiconductor Processing App 20150376792 - Spurlin; Tighe A. ; et al.	2015-12-31
Method And Apparatus For Preparing A Substrate With A Semi-noble Metal Layer App 20150299886 - Doubina; Natalia V. ; et al.	2015-10-22
Methods for reducing metal oxide surfaces to modified metal surfaces using a gaseous reducing environment Grant 9,070,750 - Spurlin , et al. June 30, 2	2015-06-30
Method And Apparatus For Remote Plasma Treatment For Reducing Metal Oxides On A Metal Seed Layer App 20150072538 - Spurlin; Tighe A. ; et al.	2015-03-12
Method And Apparatus For Remote Plasma Treatment For Reducing Metal Oxides On A Metal Seed Layer App 20140256128 - Spurlin; Tighe A. ; et al.	2014-09-11
Methods For Reducing Metal Oxide Surfaces To Modified Metal Surfaces Using A Gaseous Reducing Environment App 20140256127 - Spurlin; Tighe A. ; et al.	2014-09-11
Current Ramping And Current Pulsing Entry Of Substrates For Electroplating App 20140224661 - Spurlin; Tighe A. ; et al.	2014-08-14
Methods For Reducing Metal Oxide Surfaces To Modified Metal Surfaces App 20140199497 - Spurlin; Tighe A. ; et al.	2014-07-17
Selective Capping of Metal Interconnect Lines during Air Gap Formation App 20130323930 - Chattopadhyay; Kaushik ; et al.	2013-12-05
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte App 20130284604 - Spurlin; Tighe A. ; et al.	2013-10-31

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