Spuler; Bruno

Patent Applications and Registrations

Patent applications and USPTO patent grants for Spuler; Bruno.The latest application filed is for "method of forming an isolation layer and method of manufacturing a trench capacitor".

Company Profile

0.10.3

Spuler; Bruno - Munchen DE
Spuler; Bruno - Weixdorf DE
Spuler; Bruno - Wappinger Falls NY
Spuler; Bruno - Munich DE
Spuler; Bruno - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of forming an isolation layer and method of manufacturing a trench capacitor Grant 6,984,556 - Drabe , et al. January 10, 2	2006-01-10
Method of forming an isolation layer and method of manufacturing a trench capacitor App 20040198015 - Drabe, Christian ; et al.	2004-10-07
Semiconductor device with self-aligned contact and method for manufacturing the device Grant 6,784,553 - Zedlitz , et al. August 31, 2	2004-08-31
Method for forming dual damascene structure Grant 6,521,542 - Armacost , et al. February 18, 2	2003-02-18
Semiconductor device with self-aligned contact and method for manufacturing the device App 20020187630 - Zedlitz, Ralf ; et al.	2002-12-12
Method for clamping a semiconductor device in a manufacturing process App 20020132393 - Kraxenberger, Manfred ; et al.	2002-09-19
Method of improving the etch resistance of chemically amplified photoresists by introducing silicon after patterning Grant 6,379,869 - Schroeder , et al. April 30, 2	2002-04-30
Metallization etching techniques for reducing post-etch corrosion of metal lines Grant 6,177,353 - Gutsche , et al. January 23, 2	2001-01-23
Low pressure and low power C1.sub.2 /HC1 process for sub-micron metal etching Grant 5,976,986 - Naeem , et al. November 2, 1	1999-11-02
Deposition of carbon into nitride layer for improved selectivity of oxide to nitride etchrate for self aligned contact etching Grant 5,935,873 - Spuler , et al. August 10, 1	1999-08-10
Polycide etching with HCL and chlorine Grant 5,874,363 - Hoh , et al. February 23, 1	1999-02-23
Method for forming metallization in semiconductor devices with a self-planarizing material Grant 5,854,126 - Tobben , et al. December 29, 1	1998-12-29
Methods for metal etching with reduced sidewall build up during integrated circuit manufacturing Grant 5,846,884 - Naeem , et al. December 8, 1	1998-12-08

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