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name:-0.010970115661621
name:-0.013270139694214
name:-0.010315895080566
Spuhler; Philipp S. Patent Filings

Spuhler; Philipp S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Spuhler; Philipp S..The latest application filed is for "microfluidic sorting using high gradient magnetic fields".

Company Profile
10.11.9
  • Spuhler; Philipp S. - Boston MA
  • Spuhler; Philipp S. - Redwood City CA
  • Spuhler; Philipp S. - Brookline MA
  • Spuhler; Philipp S. - Tucson AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Microfluidic Sorting Using High Gradient Magnetic Fields
App 20220106553 - Spuhler; Philipp S. ;   et al.
2022-04-07
Microfluidic sorting with high gradient magnetic fields using opposing arrays of adjacent magnets
Grant 11,155,779 - Spuhler , et al. October 26, 2
2021-10-26
Loading station
Grant 11,061,043 - Lai , et al. July 13, 2
2021-07-13
Loading Station
App 20200217861 - Lai; Janice H. ;   et al.
2020-07-09
Loading station
Grant 10,634,691 - Lai , et al.
2020-04-28
Gasket
Grant 10,527,171 - Spuhler , et al. J
2020-01-07
Microfluidic Sorting Using High Gradient Magnetic Fields
App 20190264166 - Spuhler; Philipp S. ;   et al.
2019-08-29
Cartridge
Grant D851,275 - Spuhler , et al.
2019-06-11
Slide adapter
Grant D851,150 - Spuhler , et al.
2019-06-11
Loading Station
App 20190056415 - Lai; Janice H. ;   et al.
2019-02-21
Gasket
App 20190056028 - Spuhler; Philipp S. ;   et al.
2019-02-21
Microfluidic sorting using high gradient magnetic fields
Grant 10,202,577 - Spuhler , et al. Feb
2019-02-12
Microfluidic Sorting Using High Gradient Magnetic Fields
App 20160244714 - Spuhler; Philipp S. ;   et al.
2016-08-25
Circuit for the detection of solder-joint failures in a digital electronic package
Grant 8,030,943 - Spuhler , et al. October 4, 2
2011-10-04
Circuit For The Detection Of Solder-joint Failures In A Digital Electronic Package
App 20090160457 - Spuhler; Philipp S. ;   et al.
2009-06-25
Method and circuit for the detection of solder-joint failures in a digital electronic package
Grant 7,501,832 - Spuhler , et al. March 10, 2
2009-03-10
Die-level process monitor and method
Grant 7,239,163 - Ralston-Good , et al. July 3, 2
2007-07-03
Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package
Grant 7,196,294 - Hofmeister , et al. March 27, 2
2007-03-27
Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package
App 20060191889 - Hofmeister; James P. ;   et al.
2006-08-31
Method and circuit for the detection of solder-joint failures in a digital electronic package
App 20060194353 - Spuhler; Philipp S. ;   et al.
2006-08-31

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