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Patent applications and USPTO patent grants for Spry; David J..The latest application filed is for "compensation for device property variation according to wafer location".
Patent | Date |
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Compensation for device property variation according to wafer location Grant 11,128,293 - Krasowski , et al. September 21, 2 | 2021-09-21 |
Reliability extreme temperature integrated circuits and method for producing the same Grant 11,004,802 - Spry , et al. May 11, 2 | 2021-05-11 |
Larger-area integrated electrical metallization dielectric structures with stress-managed unit cells for more capable extreme environment semiconductor electronics Grant 10,490,550 - Spry , et al. Nov | 2019-11-26 |
Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits Grant 10,256,202 - Spry , et al. | 2019-04-09 |
Interconnection of semiconductor devices in extreme environment microelectronic integrated circuit chips Grant 9,978,686 - Spry , et al. May 22, 2 | 2018-05-22 |
Method for the growth of large low-defect single crystals Grant 7,449,065 - Powell , et al. November 11, 2 | 2008-11-11 |
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