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Patent applications and USPTO patent grants for Sprogis; Edmund.The latest application filed is for "metal wiring structures for uniform current density in c4 balls".
Patent | Date |
---|---|
Metal wiring structures for uniform current density in C4 balls Grant 8,264,078 - Daubenspeck , et al. September 11, 2 | 2012-09-11 |
Metal Wiring Structures For Uniform Current Density In C4 Balls App 20120080797 - Daubenspeck; Timothy H. ;   et al. | 2012-04-05 |
Metal wiring structures for uniform current density in C4 balls Grant 8,084,858 - Daubenspeck , et al. December 27, 2 | 2011-12-27 |
Dual-sided chip attached modules Grant 7,863,734 - Bernstein , et al. January 4, 2 | 2011-01-04 |
Metal Wiring Structures For Uniform Current Density In C4 Balls App 20100263913 - Daubenspeck; Timothy H. ;   et al. | 2010-10-21 |
Dual-sided Chip Attached Modules App 20090065925 - Bernstein; Kerry ;   et al. | 2009-03-12 |
Dual-sided chip attached modules Grant 7,462,509 - Bernstein , et al. December 9, 2 | 2008-12-09 |
Dual-sided Chip Attached Modules App 20070267746 - Bernstein; Kerry ;   et al. | 2007-11-22 |
Self-aligned contact areas for sidewall image transfer formed conductors Grant 6,949,458 - Conrad , et al. September 27, 2 | 2005-09-27 |
Self-aligned contact areas for sidewall image transfer formed conductors App 20030115750 - Conrad, Edward W. ;   et al. | 2003-06-26 |
Self-aligned contact areas for sidewall image transfer formed conductors Grant 6,566,759 - Conrad , et al. May 20, 2 | 2003-05-20 |
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