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Patent applications and USPTO patent grants for Sporn; Martin.The latest application filed is for "semiconductor wafer and method for processing a semiconductor wafer".
Patent | Date |
---|---|
Semiconductor wafer and method for processing a semiconductor wafer Grant 10,325,803 - Kuenle , et al. | 2019-06-18 |
Semiconductor Wafer And Method For Processing A Semiconductor Wafer App 20180247857 - KUENLE; Matthias ;   et al. | 2018-08-30 |
Semiconductor wafer and method for processing a semiconductor wafer Grant 9,984,915 - Kuenle , et al. May 29, 2 | 2018-05-29 |
Contacts for semiconductor devices and methods of forming thereof Grant 9,824,972 - Harrison , et al. November 21, 2 | 2017-11-21 |
Contacts for Semiconductor Devices and Methods of Forming Thereof App 20170098614 - Harrison; Mark James ;   et al. | 2017-04-06 |
Contacts for semiconductor devices and methods of forming thereof Grant 9,553,016 - Harrison , et al. January 24, 2 | 2017-01-24 |
Semiconductor chip with structured sidewalls Grant 9,496,193 - Roesner , et al. November 15, 2 | 2016-11-15 |
Contacts for Semiconductor Devices and Methods of Forming Thereof App 20160005647 - Harrison; Mark James ;   et al. | 2016-01-07 |
Semiconductor Wafer And Method For Processing A Semiconductor Wafer App 20150348824 - Kuenle; Matthias ;   et al. | 2015-12-03 |
Layer stack Grant 9,006,899 - Ganitzer , et al. April 14, 2 | 2015-04-14 |
Method of Fabricating a Layer Stack App 20140167270 - Ganitzer; Paul ;   et al. | 2014-06-19 |
Device and method including a soldering process Grant 8,710,678 - Ganitzer , et al. April 29, 2 | 2014-04-29 |
Device And Method Including A Soldering Process App 20120267770 - Ganitzer; Paul ;   et al. | 2012-10-25 |
Device and method including a soldering process Grant 8,211,752 - Ganitzer , et al. July 3, 2 | 2012-07-03 |
Sputter Deposition Method, Sputter Deposition System and Chip App 20090220777 - Sporn; Martin | 2009-09-03 |
Device And Method Including A Soldering Process App 20090134501 - Ganitzer; Paul ;   et al. | 2009-05-28 |
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