Spielberger; Richard K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Spielberger; Richard K..The latest application filed is for "integrated circuit package with top-side conduction cooling".
- Spielberger; Richard K. - Hanover MN
- Spielberger; Richard K. - Hannover MN
- Spielberger; Richard K. - Maple Grove MN
| Patent | Date |
|---|---|
| Method and system for stacking integrated circuits Grant 7,863,720 - Jensen , et al. January 4, 2 | 2011-01-04 |
| System and method for sealing a MEMS device Grant 7,736,946 - Seppala , et al. June 15, 2 | 2010-06-15 |
| Integrated circuit package with top-side conduction cooling Grant 7,635,916 - Jensen , et al. December 22, 2 | 2009-12-22 |
| Shielding arrangement to protect a circuit from stray magnetic fields Grant 7,569,915 - Spielberger , et al. August 4, 2 | 2009-08-04 |
| Integrated Circuit Package With Top-Side Conduction Cooling App 20080272482 - Jensen; Ronald J. ; et al. | 2008-11-06 |
| System And Method For Sealing A Mems Device App 20080188035 - Seppala; Bryan R. ; et al. | 2008-08-07 |
| Shielding arrangement to protect a circuit from stray magnetic fields App 20060237823 - Spielberger; Richard K. ; et al. | 2006-10-26 |
| Shielding arrangement to protect a circuit from stray magnetic fields Grant 7,078,243 - Spielberger , et al. July 18, 2 | 2006-07-18 |
| Method and system for stacking integrated circuits App 20050258528 - Jensen, Ronald J. ; et al. | 2005-11-24 |
| Methods for providing a magnetic shield for an integrated circuit having magnetoresistive memory cells Grant 6,916,668 - Spielberger , et al. July 12, 2 | 2005-07-12 |
| Shielding arrangement to protect a circuit from stray magnetic fields App 20050130327 - Spielberger, Richard K. ; et al. | 2005-06-16 |
| Stacked ball grid array Grant 6,657,134 - Spielberger , et al. December 2, 2 | 2003-12-02 |
| IC package lid for dose enhancement protection Grant 6,611,054 - Dunaway , et al. August 26, 2 | 2003-08-26 |
| Ball grid array package App 20030102156 - Spielberger, Richard K. ; et al. | 2003-06-05 |
| Shielding arrangement to protect a circuit from stray magnetic fields App 20030098469 - Spielberger, Richard K. ; et al. | 2003-05-29 |
| Shielding arrangement to protect a circuit from stray magnetic fields Grant 6,515,352 - Spielberger , et al. February 4, 2 | 2003-02-04 |
| Three axis sensor package on flexible substrate Grant 6,169,254 - Pant , et al. January 2, 2 | 2001-01-02 |
| Method to permit high temperature assembly processes for magnetically sensitive devices Grant 6,027,948 - Jensen , et al. February 22, 2 | 2000-02-22 |
| Chip stacking and capacitor mounting arrangement including spacers Grant 6,005,778 - Spielberger , et al. December 21, 1 | 1999-12-21 |
| Radiation enhanced chip encapsulant Grant 5,998,867 - Jensen , et al. December 7, 1 | 1999-12-07 |
| Shielded package for magnetic devices Grant 5,939,772 - Hurst , et al. August 17, 1 | 1999-08-17 |
| Test and tear-away bond pad design Grant 5,891,745 - Dunaway , et al. April 6, 1 | 1999-04-06 |
| Miniature magnetometer and flexible circuit Grant 5,644,230 - Pant , et al. July 1, 1 | 1997-07-01 |
| Semiconductor package with weldable ceramic lid Grant 5,498,900 - Dunaway , et al. March 12, 1 | 1996-03-12 |
| Package to semiconductor chip active interconnect site method Grant 5,161,729 - Dunaway , et al. November 10, 1 | 1992-11-10 |
| Method of making a surface etched shadow mask Grant 5,139,610 - Dunaway , et al. August 18, 1 | 1992-08-18 |
| Stacked tab leadframe assembly Grant 5,099,306 - Dunaway , et al. March 24, 1 | 1992-03-24 |
| Method of die bonding semiconductor chip by using removable frame Grant 5,074,036 - Dunaway , et al. * December 24, 1 | 1991-12-24 |
| Universal semiconductor chip package Grant 5,066,831 - Spielberger , et al. November 19, 1 | 1991-11-19 |
| Method of manufacturing a leadframe having conductive elements preformed with solder bumps Grant 5,066,614 - Dunaway , et al. November 19, 1 | 1991-11-19 |
| Universal semiconductor chip package Grant 5,036,163 - Spielberger , et al. July 30, 1 | 1991-07-30 |
| Package to board variable pitch tab Grant 4,999,700 - Dunaway , et al. March 12, 1 | 1991-03-12 |
| Integrated semiconductor package Grant 4,982,267 - Mones , et al. January 1, 1 | 1991-01-01 |
| Method of manufacturing a high-yield solder bumped semiconductor wafer Grant 4,898,320 - Dunaway , et al. February 6, 1 | 1990-02-06 |
| Optoelectronic lens array with an integrated circuit Grant 4,528,446 - Dunaway , et al. July 9, 1 | 1985-07-09 |
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