loadpatents
name:-0.0063531398773193
name:-0.0029580593109131
name:-0.00034904479980469
Speetjens; Frank Patent Filings

Speetjens; Frank

Patent Applications and Registrations

Patent applications and USPTO patent grants for Speetjens; Frank.The latest application filed is for "systems and methods for mitigating crack propagation in semiconductor die manufacturing".

Company Profile
0.2.5
  • Speetjens; Frank - Boise ID
  • Speetjens; Frank - Elsloo NL
  • Speetjens, Frank - Bosrank NL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Systems And Methods For Mitigating Crack Propagation In Semiconductor Die Manufacturing
App 20220208609 - Ng; Wei Yeeng ;   et al.
2022-06-30
Conductive Interconnects and Methods of Forming Conductive Interconnects
App 20220199123 - Ahmed; Raju ;   et al.
2022-06-23
Conductive interconnects and methods of forming conductive interconnects
Grant 11,328,749 - Ahmed , et al. May 10, 2
2022-05-10
Conductive Interconnects and Methods of Forming Conductive Interconnects
App 20210249304 - Ahmed; Raju ;   et al.
2021-08-12
Conductive Interconnects and Methods of Forming Conductive Interconnects
App 20210193189 - Ahmed; Raju ;   et al.
2021-06-24
Method for manufacturing a sequential backplane
Grant 7,172,805 - Hermkens , et al. February 6, 2
2007-02-06
Method for manufacturing a sequential backplane
App 20050109532 - Hermkens, Gerald A.J. ;   et al.
2005-05-26

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