SPEEDFAM CO., LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for SPEEDFAM CO., LTD..The latest application filed is for "local dry etching apparatus".
Company Profile
1.37.21
Trademarks
- SPEEDFAM CO., LTD. - Kanagawa JP
- SPEEDFAM Co., Ltd. - Ayase-city JP
- Speedfam Co., Ltd. - Ayase-shi JP
- Speedfam Co., Ltd. -
- Speedfam Co., Ltd. - Ayase JP
- Speedfam Co., Ltd. - Kanagawa-Pref. JP
- SpeedFam Co Ltd - Kanagawa-pref JP
- SpeedFam Co., Ltd. - Tokyo JP
- SpeedFam Co., Ltd. - JP JP
- SpeedFam Co., Ltd - Tokyo JP
- Speedfam Company Limited - Tokyo JP
Trademarks
Patent Activity
| Patent | Date |
|---|---|
| Local dry etching apparatus Grant 11,145,492 - Obara October 12, 2 | 2021-10-12 |
| Local Dry Etching Apparatus App 20200135429 - OBARA; Yasushi | 2020-04-30 |
| Local Dry Etching Apparatus App 20170278674 - OBARA; Yasushi | 2017-09-28 |
| Local Dry Etching Apparatus And Local Dry Etching Fabrication Method App 20160203989 - OBARA; Yasushi | 2016-07-14 |
| Outer periphery polishing apparatus for disc-shaped workpiece Grant 9,358,655 - Kato , et al. June 7, 2 | 2016-06-07 |
| Local Dry Etching Apparatus App 20160104601 - OBARA; Yasushi | 2016-04-14 |
| Outer Periphery Polishing Apparatus For Disc-shaped Workpiece App 20150283664 - Kato; Tadahiro ; et al. | 2015-10-08 |
| Polishing composition for semiconductor wafer and polishing method Grant 8,114,178 - Izumi , et al. February 14, 2 | 2012-02-14 |
| Carrier for holding an object to be polished App 20090203300 - Yoshida; Akira ; et al. | 2009-08-13 |
| Composition for polishing semiconductor wafer, and method of producing the same App 20080237535 - Maejima; Kuniaki ; et al. | 2008-10-02 |
| Thickness control method and double side polisher Grant 7,147,541 - Nagayama , et al. December 12, 2 | 2006-12-12 |
| Thickness control method and double side polisher Grant 7,137,867 - Nagayama , et al. November 21, 2 | 2006-11-21 |
| Thickness control method and double side polisher App 20060194511 - Nagayama; Hitoshi ; et al. | 2006-08-31 |
| Thickness control method and double side polisher App 20060194512 - Nagayama; Hitoshi ; et al. | 2006-08-31 |
| Local dry etching method Grant 7,094,355 - Yanagisawa , et al. August 22, 2 | 2006-08-22 |
| Wafer table for local dry etching apparatus Grant 7,005,032 - Yanagisawa , et al. February 28, 2 | 2006-02-28 |
| Local dry etching method Grant 6,908,566 - Yanagisawa , et al. June 21, 2 | 2005-06-21 |
| Nanotopography removing method Grant 6,875,701 - Yanagisawa , et al. April 5, 2 | 2005-04-05 |
| Wafer edge polishing system Grant 6,840,841 - Hakomori January 11, 2 | 2005-01-11 |
| Apparatus for polishing periphery of device wafer and polishing method Grant 6,773,335 - Hakomori August 10, 2 | 2004-08-10 |
| Local dry etching method App 20040142571 - Yanagisawa, Michihiko ; et al. | 2004-07-22 |
| Multi-step local dry etching method for SOI wafer App 20040063329 - Yanagisawa, Michihiko ; et al. | 2004-04-01 |
| Local dry etching method Grant 6,649,528 - Yanagisawa , et al. November 18, 2 | 2003-11-18 |
| Polishing method for removing corner material from a semi-conductor wafer Grant 6,638,147 - Shiino , et al. October 28, 2 | 2003-10-28 |
| Local dry etching method App 20030199168 - Yanagisawa, Michihiko ; et al. | 2003-10-23 |
| Wafer edge polishing system App 20030134570 - Hakomori, Shunji | 2003-07-17 |
| Polishing method for removing corner material from a semi-conductor wafer App 20020182985 - Shiino, Masami ; et al. | 2002-12-05 |
| Local dry etching method App 20020173149 - Yanagisawa, Michihiko ; et al. | 2002-11-21 |
| Local etching apparatus and local etching method App 20020008082 - Tanaka, Chikai ; et al. | 2002-01-24 |
| Apparatus for removing deposited film App 20010034194 - Hakomori, Shunji | 2001-10-25 |
| Polishing compound and a method for polishing Grant 6,300,249 - Yoshida , et al. October 9, 2 | 2001-10-09 |
| Carriers and polishing apparatus Grant 6,273,803 - Wang , et al. August 14, 2 | 2001-08-14 |
| Wafer flattening process and system App 20010007275 - Yanagisawa, Michihiko ; et al. | 2001-07-12 |
| Apparatus for polishing outer periphery of workpiece Grant 6,250,995 - Hakomori June 26, 2 | 2001-06-26 |
| Plasma etching method and plasma etching system for carrying out the same Grant 6,159,388 - Yanagisawa , et al. December 12, 2 | 2000-12-12 |
| Slurry recycling system of CMP apparatus and method of same Grant 6,126,531 - Iida , et al. October 3, 2 | 2000-10-03 |
| Carrier and polishing apparatus Grant 6,110,026 - Arai August 29, 2 | 2000-08-29 |
| Wafer processing machine and a processing method thereby Grant 6,093,087 - Hakomori , et al. July 25, 2 | 2000-07-25 |
| Polishing apparatus Grant 6,074,277 - Arai June 13, 2 | 2000-06-13 |
| Workpiece surface processing apparatus Grant 6,068,545 - Arai May 30, 2 | 2000-05-30 |
| Planarization method, workpiece measuring method, and surface planarization apparatus having a measuring device Grant 6,066,230 - Arai May 23, 2 | 2000-05-23 |
| Polishing amount control system and method for same Grant 6,062,949 - Yashiki , et al. May 16, 2 | 2000-05-16 |
| Cleaning apparatus Grant 6,041,465 - Yashiki , et al. March 28, 2 | 2000-03-28 |
| Carrier and CMP apparatus Grant 6,012,964 - Arai , et al. January 11, 2 | 2000-01-11 |
| Plasma etching method Grant 5,980,769 - Yanagisawa , et al. November 9, 1 | 1999-11-09 |
| Washing apparatus for disc-like workpieces Grant 5,810,028 - Ichikawa , et al. September 22, 1 | 1998-09-22 |
| Disc streak pattern forming method and apparatus Grant 5,800,253 - Ikemoto * September 1, 1 | 1998-09-01 |
| Disc streak pattern forming method and apparatus Grant 5,690,542 - Ikemoto November 25, 1 | 1997-11-25 |
| Flattening method and flattening apparatus of a semiconductor device Grant 5,605,499 - Sugiyama , et al. February 25, 1 | 1997-02-25 |
| Flat lapping machine with sizing mechanism Grant 5,099,614 - Arai , et al. March 31, 1 | 1992-03-31 |
| Specular machining apparatus for peripheral edge portion of wafer Grant 5,097,630 - Maeda , et al. March 24, 1 | 1992-03-24 |
| Edge polisher Grant 5,094,037 - Hakomori , et al. March 10, 1 | 1992-03-10 |
| Surface processing machine for hard disks and the like Grant 5,065,547 - Shimizu , et al. * November 19, 1 | 1991-11-19 |
| Flat lapping machine Grant 4,805,348 - Arai , et al. February 21, 1 | 1989-02-21 |
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