Sowatzke; David A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sowatzke; David A..The latest application filed is for "plated polymeric article including tin/copper tie/seed layer".
- Sowatzke; David A. - Spring Valley WI
| Patent | Date |
|---|---|
| Plated Polymeric Article Including Tin/Copper Tie/Seed Layer App 20210310145 - Hebert; Larry S. ; et al. | 2021-10-07 |
| Plated polymeric article including tin/copper tie/seed layer Grant 11,066,753 - Hebert , et al. July 20, 2 | 2021-07-20 |
| Plated Polymeric Article Including Tin/copper Tie/seed Layer App 20180187323 - Hebert; Larry S. ; et al. | 2018-07-05 |
| Multilayer Emi Shielding Thin Film With High Rf Permeability App 20120236528 - Le; John D. ; et al. | 2012-09-20 |
| Catalyst Particle Size Control With Organic Pigments App 20100273093 - Debe; Mark K. ; et al. | 2010-10-28 |
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