Soutome; Masayuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Soutome; Masayuki.The latest application filed is for "semiconductor device".

Company Profile

3.7.10

Soutome; Masayuki - Matsumoto JP
SOUTOME; Masayuki - Matsumoto-city JP
Soutome; Masayuki - Kawasaki JP
SOUTOME; Masayuki - Matsumoto-shi JP
SOUTOME; Masayuki - Tokyo JP
Soutome; Masayuki - Nagano JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Member for semiconductor device Grant 11,107,787 - Sano , et al. August 31, 2	2021-08-31
Semiconductor device having circuit board to which contact part is bonded Grant 11,107,784 - Maruyama , et al. August 31, 2	2021-08-31
Semiconductor Device App 20200194392 - MARUYAMA; Rikihiro ; et al.	2020-06-18
Semiconductor module radiator plate fabrication method, radiator plate, and semiconductor module using the same Grant 10,262,874 - Uezato , et al.	2019-04-16
Method For Producing Member For Semiconductor Device And Semiconductor Device, And Member For Semiconductor Device App 20190081020 - SANO; Shinji ; et al.	2019-03-14
Method for producing member for semiconductor device and semiconductor device, and member for semiconductor device Grant 10,153,246 - Sano , et al. Dec	2018-12-11
Method For Producing Member For Semiconductor Device And Semiconductor Device, And Member For Semiconductor Device App 20170207187 - SANO; Shinji ; et al.	2017-07-20
Semiconductor Module Radiator Plate Fabrication Method, Radiator Plate, And Semiconductor Module Using The Same App 20170011935 - UEZATO; Yoshinori ; et al.	2017-01-12
Semiconductor Module Radiator Plate Fabrication Method, Radiator Plate, And Semiconductor Module Using The Same App 20130306296 - Uezato; Yoshinori ; et al.	2013-11-21
Lead-free Solder App 20120111924 - MAKITA; Kazuyuki ; et al.	2012-05-10
Power semiconductor module and method of manufacturing the same Grant 8,158,458 - Ikawa , et al. April 17, 2	2012-04-17
Power semiconductor module and method of manufacturing the same Grant 7,723,846 - Ikawa , et al. May 25, 2	2010-05-25
Power Semiconductor Module And Method Of Manufacturing The Same App 20100055845 - IKAWA; Osamu ; et al.	2010-03-04
Lead-free Solder App 20090286093 - MAKITA; Kazuyuki ; et al.	2009-11-19
Semiconductor device Grant D587,662 - Soutome , et al. March 3, 2	2009-03-03
Lead-free solder App 20070029678 - Makita; Kazuyuki ; et al.	2007-02-08
Power semiconductor module and method of manufacturing the same App 20060060982 - Ikawa; Osamu ; et al.	2006-03-23

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