| Patent | Date |
|---|
Radio-frequency (RF)-interface and modular plate
Grant 11,444,365 - Benedict , et al. September 13, 2 | 2022-09-13 |
Method of manufacturing radio frequency interconnections
Grant 11,375,609 - Sikina , et al. June 28, 2 | 2022-06-28 |
Low Profile Phased Array
App 20220052460 - Sikina; Thomas V. ; et al. | 2022-02-17 |
Preparation Of Solder Bump For Compatibility With Printed Electronics And Enhanced Via Reliability
App 20210400820 - Benedict; James E. ; et al. | 2021-12-23 |
System And Method For Fabricating Z-axis Vertical Launch
App 20210368629 - Pevzner; Mikhail ; et al. | 2021-11-25 |
Process for removing bond film from cavities in printed circuit boards
Grant 11,171,101 - Benedict , et al. November 9, 2 | 2021-11-09 |
Low profile phased array
Grant 11,158,955 - Sikina , et al. October 26, 2 | 2021-10-26 |
Advanced communications array
Grant 11,145,952 - Sikina , et al. October 12, 2 | 2021-10-12 |
Interlocking modular beamformer
Grant 11,145,977 - Wilder , et al. October 12, 2 | 2021-10-12 |
Process For Removing Bond Film From Cavities In Printed Circuit Boards
App 20210305187 - Benedict; James E. ; et al. | 2021-09-30 |
Radio-frequency (rf)-interface And Modular Plate
App 20210296751 - BENEDICT; JAMES ; et al. | 2021-09-23 |
Preparation of solder bump for compatibility with printed electronics and enhanced via reliability
Grant 11,122,692 - Benedict , et al. September 14, 2 | 2021-09-14 |
Thick film resistors having customizable resistances and methods of manufacture
Grant 11,107,610 - Klek , et al. August 31, 2 | 2021-08-31 |
Apparatus for fabricating Z-axis vertical launch within a printed circuit board
Grant 11,109,489 - Pevzner , et al. August 31, 2 | 2021-08-31 |
Additive manufacturing technology (AMT) low profile signal divider
Grant 11,089,687 - Nufio-Molina , et al. August 10, 2 | 2021-08-10 |
Advanced Communications Array
App 20210151855 - Sikina; Thomas V. ; et al. | 2021-05-20 |
Printed Circuit Board Automated Layup System
App 20210144892 - Pevzner; Mikhail ; et al. | 2021-05-13 |
Method For Forming Channels In Printed Circuit Boards By Stacking Slotted Layers
App 20210144864 - Pevzner; Mikhail ; et al. | 2021-05-13 |
Snap-rf Interconnections
App 20210059043 - Sikina; Thomas V. ; et al. | 2021-02-25 |
System And Method For Fabricating Z-axis Vertical Launch
App 20210051805 - Pevzner; Mikhail ; et al. | 2021-02-18 |
Interlocking Modular Beamformer
App 20200395651 - Wilder; Kevin ; et al. | 2020-12-17 |
SNAP-RF interconnections
Grant 10,849,219 - Sikina , et al. November 24, 2 | 2020-11-24 |
Thick Film Resistors Having Customizable Resistances And Methods Of Manufacture
App 20200365300 - Klek; Erika C. ; et al. | 2020-11-19 |
Flat-wire Copper Vertical Launch Microwave Interconnection Method
App 20200367357 - Benedict; James E. ; et al. | 2020-11-19 |
Thick film resistors having customizable resistances and methods of manufacture
Grant 10,839,992 - Klek , et al. November 17, 2 | 2020-11-17 |
Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion
Grant 10,813,210 - Azadzoi , et al. October 20, 2 | 2020-10-20 |
Additive manufacturing technology (AMT) inverted pad interface
Grant 10,631,405 - Benedict , et al. | 2020-04-21 |
Additive Manufacturing Technology (amt) Low Profile Signal Divider
App 20190269021 - Nufio-Molina; Jonathan E. ; et al. | 2019-08-29 |
Snap-rf Interconnections
App 20190269007 - Sikina; Thomas V. ; et al. | 2019-08-29 |
Low Profile Phased Array
App 20190148828 - Sikina; Thomas V. ; et al. | 2019-05-16 |
Additive Manufacturing Technology (amt) Faraday Boundaries In Radio Frequency Circuits
App 20190150271 - Azadzoi; Semira M. ; et al. | 2019-05-16 |
Additive Manufacturing Technology Microwave Vertical Launch
App 20190150296 - Southworth; Andrew R. ; et al. | 2019-05-16 |
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