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SOUMA; Daisuke Patent Filings

SOUMA; Daisuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for SOUMA; Daisuke.The latest application filed is for "core material, electronic component and method for forming bump electrode".

Company Profile
0.4.6
  • SOUMA; Daisuke - Tokyo JP
  • Souma; Daisuke - Tochigi JP
  • Souma, Daisuke - Haga-gun JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Core Material, Electronic Component And Method For Forming Bump Electrode
App 20220212294 - KONDOH; Shigeki ;   et al.
2022-07-07
Core Material, Electronic Component And Method For Forming Bump Electrode
App 20220077093 - KONDOH; Shigeki ;   et al.
2022-03-10
Method For Forming Bump Electrode Substrate
App 20210387276 - HATTORI; Takahiro ;   et al.
2021-12-16
Storing package unit and a storing method for micro solder spheres
Grant 8,434,614 - Sato , et al. May 7, 2
2013-05-07
Storing Package Unit And A Storing Method For Micro Solder Spheres
App 20110198253 - Sato; Isamu ;   et al.
2011-08-18
Lead-free solder ball
Grant 7,750,475 - Souma , et al. July 6, 2
2010-07-06
Lead-free solder
Grant 7,282,175 - Amagai , et al. October 16, 2
2007-10-16
Lead-free solder ball
App 20070069379 - Souma; Daisuke ;   et al.
2007-03-29
Lead-free solder
App 20040262779 - Amagai, Masazumi ;   et al.
2004-12-30

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