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Patent applications and USPTO patent grants for SOUMA; Daisuke.The latest application filed is for "core material, electronic component and method for forming bump electrode".
Patent | Date |
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Core Material, Electronic Component And Method For Forming Bump Electrode App 20220212294 - KONDOH; Shigeki ;   et al. | 2022-07-07 |
Core Material, Electronic Component And Method For Forming Bump Electrode App 20220077093 - KONDOH; Shigeki ;   et al. | 2022-03-10 |
Method For Forming Bump Electrode Substrate App 20210387276 - HATTORI; Takahiro ;   et al. | 2021-12-16 |
Storing package unit and a storing method for micro solder spheres Grant 8,434,614 - Sato , et al. May 7, 2 | 2013-05-07 |
Storing Package Unit And A Storing Method For Micro Solder Spheres App 20110198253 - Sato; Isamu ;   et al. | 2011-08-18 |
Lead-free solder ball Grant 7,750,475 - Souma , et al. July 6, 2 | 2010-07-06 |
Lead-free solder Grant 7,282,175 - Amagai , et al. October 16, 2 | 2007-10-16 |
Lead-free solder ball App 20070069379 - Souma; Daisuke ;   et al. | 2007-03-29 |
Lead-free solder App 20040262779 - Amagai, Masazumi ;   et al. | 2004-12-30 |
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