SOTO; Javier

Patent Applications and Registrations

Patent applications and USPTO patent grants for SOTO; Javier.The latest application filed is for "low loss and low cross talk transmission lines using shaped vias".

Company Profile

3.7.10

SOTO; Javier - Chandler AZ
Soto; Javier - Burbank CA
Soto, Javier - Vigo ES

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias App 20220231394 - ELSHERBINI; Adel A. ; et al.	2022-07-21
Low loss and low cross talk transmission lines having l-shaped cross sections Grant 11,329,358 - Elsherbini , et al. May 10, 2	2022-05-10
Directed wind effect for AR/VR experience Grant 10,898,798 - Chapman , et al. January 26, 2	2021-01-26
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias App 20200235449 - ELSHERBINI; Adel A. ; et al.	2020-07-23
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs Grant 10,651,525 - Elsherbini , et al.	2020-05-12
Lithographacally defined vias for organic package substrate scaling Grant 10,381,291 - Elsherbini , et al. A	2019-08-13
Directed Wind Effect For Ar/vr Experience App 20190192965 - CHAPMAN; STEVEN M. ; et al.	2019-06-27
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias App 20180288868 - ELSHERBINI; Adel A. ; et al.	2018-10-04
Lithographacally Defined Vias For Organic Package Substrate Scaling App 20180233431 - ELSHERBINI; Adel A. ; et al.	2018-08-16
Low loss and low cross talk transmission lines using shaped vias Grant 9,992,859 - Elsherbini , et al. June 5, 2	2018-06-05
Low Loss and Low Cross Talk Transmission Lines using Shaped Vias App 20170093007 - ELSHERBINI; Adel A. ; et al.	2017-03-30
Processes of making pad-less interconnect for electrical coreless substrate Grant 9,049,807 - Soto , et al. June 2, 2	2015-06-02
Semiconductor Device With Package To Package Connection App 20090321906 - Watts; Nicholas Randolph ; et al.	2009-12-31
Direct layer laser lamination for electrical bump substrates, and processes of making same App 20090314519 - Soto; Javier ; et al.	2009-12-24
Oligobenzimidazole derivatives and their use as DNA transfecting agents App 20030105048 - Scherman, Daniel ; et al.	2003-06-05

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