Sorce; Peter J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sorce; Peter J..The latest application filed is for "method for forming solder bumps using sacrificial layer".

Company Profile

2.11.9

Sorce; Peter J. - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for forming solder bumps using sacrificial layer Grant 10,535,592 - Lewandowski , et al. Ja	2020-01-14
Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology Grant 10,168,478 - Babakhani , et al. J	2019-01-01
Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology Grant 10,168,477 - Babakhani , et al. J	2019-01-01
Method For Forming Solder Bumps Using Sacrificial Layer App 20180218971 - Lewandowski; Eric P. ; et al.	2018-08-02
Method For Forming Solder Bumps Using Sacrificial Layer App 20180218970 - Lewandowski; Eric P. ; et al.	2018-08-02
Method for forming solder bumps using sacrificial layer Grant 9,953,908 - Lewandowski , et al. April 24, 2	2018-04-24
Substrate via filling Grant 9,872,394 - Cordes , et al. January 16, 2	2018-01-16
Integration Of Photonic, Electronic, And Sensor Devices With Soi Vlsi Microprocessor Technology App 20170192172 - Babakhani; Aydin ; et al.	2017-07-06
Method For Forming Solder Bumps Using Sacrificial Layer App 20170125329 - Lewandowski; Eric P. ; et al.	2017-05-04
Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology Grant 9,632,251 - Babakhani , et al. April 25, 2	2017-04-25
Integration Of Photonic, Electronic, And Sensor Devices With Soi Vlsi Microprocessor Technology App 20170068050 - Babakhani; Aydin ; et al.	2017-03-09
Substrate via filling Grant 9,433,101 - Cordes , et al. August 30, 2	2016-08-30
Substrate Via Filling App 20160219715 - Cordes; Steven A. ; et al.	2016-07-28
Substrate Via Filling App 20160113119 - Cordes; Steven A. ; et al.	2016-04-21
Alignment of integrated circuit chip stack Grant 9,171,742 - Colgan , et al. October 27, 2	2015-10-27
Integration Of Photonic, Electronic, And Sensor Devices With Soi Vlsi Microprocessor Technology App 20150285998 - Babakhani; Aydin ; et al.	2015-10-08
Alignment Of Integrated Circuit Chip Stack App 20150024549 - Colgan; Evan G. ; et al.	2015-01-22
Handler attachment for integrated circuit fabrication Grant 8,388,782 - Andry , et al. March 5, 2	2013-03-05
Process for thin film interconnect Grant 5,231,751 - Sachdev , et al. August 3, 1	1993-08-03

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