| Patent | Date |
|---|
Bump-forming method using two plates and electronic device
App 20010018263 - Ochiai, Masayuki ; et al. | 2001-08-30 |
Method for fabricating solder bumps by forming solder balls with a solder ball forming member
Grant 6,025,258 - Ochiai , et al. February 15, 2 | 2000-02-15 |
Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit
Grant 6,022,759 - Seki , et al. February 8, 2 | 2000-02-08 |
Semiconductor device and method of forming the device
Grant 5,920,117 - Sono , et al. July 6, 1 | 1999-07-06 |
Semiconductor package for surface mounting
Grant 5,861,669 - Sono , et al. January 19, 1 | 1999-01-19 |
Process for manufacturing a packaged semiconductor having a divided leadframe stage
Grant 5,804,468 - Tsuji , et al. September 8, 1 | 1998-09-08 |
Semiconductor device and semiconductor device unit for a stack arrangement
Grant 5,801,439 - Fujisawa , et al. September 1, 1 | 1998-09-01 |
Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package
Grant 5,760,471 - Fujisawa , et al. June 2, 1 | 1998-06-02 |
Semiconductor device, base member for semiconductor device and semiconductor device unit
Grant 5,747,874 - Seki , et al. May 5, 1 | 1998-05-05 |
Semiconductor device unit having holder
Grant 5,684,675 - Taniguchi , et al. November 4, 1 | 1997-11-04 |
Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device
Grant 5,643,831 - Ochiai , et al. July 1, 1 | 1997-07-01 |
Semiconductor device having improved leads comprising palladium plated nickel
Grant 5,521,432 - Tsuji , et al. May 28, 1 | 1996-05-28 |
Semiconductor device and lead frame therefore
Grant 5,497,032 - Tsuji , et al. March 5, 1 | 1996-03-05 |
Semiconductor device with surface mount package adapted for vertical mounting
Grant 5,451,815 - Taniguchi , et al. September 19, 1 | 1995-09-19 |
Process for encapsulating a semiconductor package having a heat sink using a jig
Grant 5,444,025 - Sono , et al. August 22, 1 | 1995-08-22 |
Method of producing semiconductor device having radiation part made of resin containing insulator powders
Grant 5,424,251 - Sono , et al. June 13, 1 | 1995-06-13 |
Method of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leads
Grant 5,361,970 - Kasai , et al. November 8, 1 | 1994-11-08 |
Surface-mounting type semiconductor package having an improved efficiency for heat dissipation
Grant 5,305,179 - Sono , et al. April 19, 1 | 1994-04-19 |
Semiconductor device and method of producing semiconductor device
Grant 4,788,583 - Kawahara , et al. November 29, 1 | 1988-11-29 |
Resin-sealed radiation shield for a semiconductor device
Grant 4,661,837 - Sono April 28, 1 | 1987-04-28 |
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