Song; Young Kyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Song; Young Kyu.The latest application filed is for "personalized meal diet and exercise providing method using integrated health information and service system".

Company Profile

10.53.69

Song; Young Kyu - San Diego CA
SONG; Young Kyu - Seoul KR
Song; Young Kyu - El Segundo CA
Song; Young-Kyu - Markham N/A CA
Song; Young-Kyu - Scarborough CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for high-intensity radiated field (HIRF) and electromagnetic pulse (EMP) analysis of a vehicle Grant 11,378,605 - Hwang , et al. July 5, 2	2022-07-05
Personalized Meal Diet And Exercise Providing Method Using Integrated Health Information And Service System App 20220165389 - YANG; Sung Woo ; et al.	2022-05-26
Fire suppressing device Grant 11,191,983 - Hwang , et al. December 7, 2	2021-12-07
Methods of manufacturing a high impedance surface (HIS) enhanced by discrete passives Grant 11,071,213 - Muwonge , et al. July 20, 2	2021-07-20
Method For High-intensity Radiated Field (hirf) And Electromagnetic Pulse (emp) Analysis Of A Vehicle App 20210215748 - Hwang; Kyu-Pyung ; et al.	2021-07-15
High impedance surface (HIS) enhanced by discrete passives Grant 11,038,277 - Muwonge , et al. June 15, 2	2021-06-15
Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance Grant 10,980,122 - Hwang , et al. April 13, 2	2021-04-13
Thin Film Resistor Having Surface Mounted Trimming Bridges For Incrementally Tuning Resistance App 20210068256 - Hwang; Kyu-Pyung ; et al.	2021-03-04
Methods Of Manufacturing A High Impedance Surface (his) Enhanced By Discrete Passives App 20210029836 - Muwonge; Charles ; et al.	2021-01-28
High Impedance Surface (his) Enhanced By Discrete Passives App 20210028550 - Muwonge; Charles ; et al.	2021-01-28
Variable radio frequency attenuator Grant 10,903,542 - Al-Bondak , et al. January 26, 2	2021-01-26
Integrated device package comprising a real time tunable inductor implemented in a package substrate Grant 10,879,341 - Song , et al. December 29, 2	2020-12-29
Electrical Module Assembly With Embedded Dies App 20200388560 - Song; Young Kyu ; et al.	2020-12-10
Fire Suppressing Device App 20200147424 - Hwang; Kyu-Pyung ; et al.	2020-05-14
Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance Grant 10,653,013 - Hwang , et al.	2020-05-12
Metal graphic and method to produce a metal graphic Grant 10,471,679 - Song , et al. Nov	2019-11-12
Integrated device package comprising a tunable inductor Grant 10,304,623 - Song , et al.	2019-05-28
Monolithic integration of antenna switch and diplexer Grant 10,256,863 - Gu , et al.	2019-04-09
Integrated Circuit Package Comprising Surface Capacitor And Ground Plane App 20190057880 - SONG; Young Kyu ; et al.	2019-02-21
Integrated circuit package comprising surface capacitor and ground plane Grant 10,181,410 - Song , et al. Ja	2019-01-15
Patterned grounds and methods of forming the same Grant 10,109,584 - Jow , et al. October 23, 2	2018-10-23
Capacitor structure for power delivery applications Grant 10,079,097 - Song , et al. September 18, 2	2018-09-18
Embedded layered inductor Grant 10,051,741 - Song , et al. August 14, 2	2018-08-14
Semiconductor package on package structure and method of forming the same Grant 10,049,977 - We , et al. August 14, 2	2018-08-14
Known good die testing for high frequency applications Grant 9,933,455 - Song , et al. April 3, 2	2018-04-03
Low profile reinforced package-on-package semiconductor device Grant 9,875,997 - We , et al. January 23, 2	2018-01-23
Device Package With Wire Bond Assisted Grounding And Inductors App 20170338179 - THADESAR; Paragkumar Ajaybhai ; et al.	2017-11-23
Flip-chip employing integrated cavity filter, and related components, systems, and methods Grant 9,812,752 - Lee , et al. November 7, 2	2017-11-07
Solenoid inductor in a substrate Grant 9,806,144 - Kim , et al. October 31, 2	2017-10-31
Substrate comprising embedded elongated capacitor Grant 9,807,884 - Hwang , et al. October 31, 2	2017-10-31
Integrated Device Package Comprising A Tunable Inductor App 20170207022 - Song; Young Kyu ; et al.	2017-07-20
Integrated Device Package Comprising A Real Time Tunable Inductor Implemented In A Package Substrate App 20170207293 - Song; Young Kyu ; et al.	2017-07-20
Monolithic Integration Of Antenna Switch And Diplexer App 20170201291 - GU; Shiqun ; et al.	2017-07-13
Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate Grant 9,691,694 - Jow , et al. June 27, 2	2017-06-27
Multi-layer ground shield structure of interconnected elements Grant 9,691,720 - Song , et al. June 27, 2	2017-06-27
Package substrate comprising capacitor, redistribution layer and discrete coaxial connection Grant 9,659,850 - We , et al. May 23, 2	2017-05-23
Multi-layer interconnected spiral capacitor Grant 9,653,533 - Jow , et al. May 16, 2	2017-05-16
Integrated Circuit Package Comprising Surface Capacitor And Ground Plane App 20170125332 - Song; Young Kyu ; et al.	2017-05-04
Embedded multi-terminal capacitor Grant 9,628,052 - We , et al. April 18, 2	2017-04-18
Low Profile Package With Passive Device App 20170092594 - SONG; Young Kyu ; et al.	2017-03-30
Flip-chip Employing Integrated Cavity Filter, And Related Components, Systems, And Methods App 20170077574 - Lee; John Jong-Hoon ; et al.	2017-03-16
Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer Grant 9,583,433 - Song , et al. February 28, 2	2017-02-28
Inductor structure in a semiconductor device Grant 9,576,718 - Jow , et al. February 21, 2	2017-02-21
Multi-layer Ground Shield Structure Of Interconnected Elements App 20170033059 - SONG; Young Kyu ; et al.	2017-02-02
Package on package (PoP) device comprising a high performance inter package connection Grant 9,530,739 - Song , et al. December 27, 2	2016-12-27
Inductor Structure In A Semiconductor Device App 20160372253 - Jow; Uei-Ming ; et al.	2016-12-22
Capacitor Structure For Power Delivery Applications App 20160365196 - SONG; Young Kyu ; et al.	2016-12-15
Embedded sheet capacitor Grant 9,502,491 - Song , et al. November 22, 2	2016-11-22
Embedded package substrate capacitor Grant 9,502,490 - We , et al. November 22, 2	2016-11-22
Known Good Die Testing For High Frequency Applications App 20160327590 - Song; Young Kyu ; et al.	2016-11-10
Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal Grant 9,490,226 - Song , et al. November 8, 2	2016-11-08
Integrated Device Package Comprising An Electromagnetic (em) Passive Device In An Encapsulation Layer, And An Em Shield App 20160322300 - Song; Young Kyu ; et al.	2016-11-03
Power distribution improvement using pseudo-ESR control of an embedded passive capacitor Grant 9,472,425 - Song , et al. October 18, 2	2016-10-18
Power Distribution Improvement Using Pseudo-esr Control Of An Embedded Passive Capacitor App 20160276173 - SONG; Young Kyu ; et al.	2016-09-22
Embedded package substrate capacitor with configurable/controllable equivalent series resistance Grant 9,449,762 - Song , et al. September 20, 2	2016-09-20
Flip-chip employing integrated cavity filter, and related components, systems, and methods Grant 9,443,810 - Lee , et al. September 13, 2	2016-09-13
Integrated Device Package Comprising Conductive Sheet Configured As An Inductor In An Encapsulation Layer App 20160247761 - Song; Young Kyu ; et al.	2016-08-25
Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield Grant 9,425,143 - Song , et al. August 23, 2	2016-08-23
Substrate Comprising Stacks Of Interconnects, Interconnect On Solder Resist Layer And Interconnect On Side Portion Of Substrate App 20160240463 - Jow; Uei-Ming ; et al.	2016-08-18
Multi-layer Interconnected Spiral Capacitor App 20160240606 - JOW; Uei-Ming ; et al.	2016-08-18
Integrated device comprising coaxial interconnect Grant 9,385,077 - Kim , et al. July 5, 2	2016-07-05
Substrate Comprising Embedded Elongated Capacitor App 20160183378 - Hwang; Kyu-Pyung ; et al.	2016-06-23
Substrate Comprising An Embedded Capacitor App 20160183379 - Song; Young Kyu ; et al.	2016-06-23
Techniques For Controlling Equivalent Series Resistance Of A Capacitor App 20160183386 - SONG; Young Kyu ; et al.	2016-06-23
High quality factor filter implemented in wafer level packaging (WLP) integrated device Grant 9,373,583 - Lee , et al. June 21, 2	2016-06-21
Package On Package (pop) Device Comprising A High Performance Inter Package Connection App 20160172302 - Song; Young Kyu ; et al.	2016-06-16
System, Apparatus, And Method For Semiconductor Package Grounds App 20160172274 - YOON; Jung Ho ; et al.	2016-06-16
Low Profile Reinforced Package-on-package Semiconductor Device App 20160172344 - WE; Hong Bok ; et al.	2016-06-16
Package on package (PoP) integrated device comprising a capacitor in a substrate Grant 9,368,566 - Lee , et al. June 14, 2	2016-06-14
Package Substrate Comprising Capacitor, Redistribution Layer And Discrete Coaxial Connection App 20160163628 - We; Hong Bok ; et al.	2016-06-09
Integrated passive device (IPD) on substrate Grant 9,362,218 - Kim , et al. June 7, 2	2016-06-07
Semiconductor package interconnections and method of making the same Grant 9,355,963 - Kim , et al. May 31, 2	2016-05-31
Integrated Device Package Comprising Silicon Bridge In Photo Imageable Layer App 20160141234 - We; Hong Bok ; et al.	2016-05-19
Integrated Device Package Comprising An Electromagnetic (em) Passive Device In An Encapsulation Layer, And An Em Shield App 20160141244 - Song; Young Kyu ; et al.	2016-05-19
Toroid inductor in an integrated device Grant 9,324,779 - Song , et al. April 26, 2	2016-04-26
Flexible Film Electrical-test Substrates With Conductive Coupling Post(s) For Integrated Circuit (ic) Bump(s) Electrical Testing, And Related Methods And Testing Apparatuses App 20160091532 - Song; Young Kyu ; et al.	2016-03-31
Semiconductor Package Interconnections And Method Of Making The Same App 20160093571 - KIM; Dong Wook ; et al.	2016-03-31
Bandpass filter implementation on a single layer using spiral capacitors Grant 9,294,064 - Song , et al. March 22, 2	2016-03-22
Patterned Grounds And Methods Of Forming The Same App 20160066414 - JOW; Uei-Ming ; et al.	2016-03-03
Stiffener with embedded passive components Grant 9,275,876 - Kim , et al. March 1, 2	2016-03-01
Wafer Level Package (wlp) Integrated Device Comprising Electromagnetic (em) Passive Device In Redistribution Portion, And Radio Frequency (rf) Shield App 20160056226 - Song; Young Kyu ; et al.	2016-02-25
Package Substrates Including Embedded Capacitors App 20160055976 - Song; Young Kyu ; et al.	2016-02-25
Pattern between pattern for low profile substrate Grant 9,269,610 - We , et al. February 23, 2	2016-02-23
Fishbone Lc Component And Method Of Making The Same App 20160049458 - SONG; Young Kyu ; et al.	2016-02-18
Integrated Device Comprising A Heat-dissipation Layer Providing An Electrical Path For A Ground Signal App 20160049378 - Song; Young Kyu ; et al.	2016-02-18
Semiconductor Package On Package Structure And Method Of Forming The Same App 20160035664 - WE; Hong Bok ; et al.	2016-02-04
Probes And Probe Assemblies For Wafer Probing App 20160025776 - SONG; Young Kyu ; et al.	2016-01-28
Inductor design on floating UBM balls for wafer level package (WLP) Grant 9,245,940 - Song , et al. January 26, 2	2016-01-26
High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB) Grant 9,247,647 - Yoon , et al. January 26, 2	2016-01-26
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR IN A SUBSTRATE App 20160020193 - Lee; Jong-Hoon ; et al.	2016-01-21
Integrated Device Comprising Coaxial Interconnect App 20160013125 - Kim; Dong Wook ; et al.	2016-01-14
Embedded Package Substrate Capacitor App 20150340425 - We; Hong Bok ; et al.	2015-11-26
Embedded Package Substrate Capacitor With Configurable/controllable Equivalent Series Resistance App 20150325375 - Song; Young Kyu ; et al.	2015-11-12
Embedded Sheet Capacitor App 20150311275 - Song; Young Kyu ; et al.	2015-10-29
Ceramic Interposer Capacitor App 20150294791 - Hwang; Kyu-Pyung ; et al.	2015-10-15
Pattern Between Pattern For Low Profile Substrate App 20150294933 - We; Hong Bok ; et al.	2015-10-15
Embedded Multi-terminal Capacitor App 20150236681 - We; Hong Bok ; et al.	2015-08-20
Low-profile Package With Passive Device App 20150237732 - Velez; Mario Francisco ; et al.	2015-08-20
Inductor Design On Floating Ubm Balls For Wafer Level Package (wlp) App 20150228707 - SONG; Young Kyu ; et al.	2015-08-13
Embedded sheet capacitor Grant 9,093,295 - Song , et al. July 28, 2	2015-07-28
Low Cost Connector For High Speed, High Density Signal Delivery App 20150187731 - KIM; Dong Wook ; et al.	2015-07-02
Multilayer Ceramic Capacitor Including At Least One Slot App 20150146340 - Yun; Changhan Hobie ; et al.	2015-05-28
Thermal design and electrical routing for multiple stacked packages using through via insert (TVI) Grant 9,041,212 - Kim , et al. May 26, 2	2015-05-26
Embedded Sheet Capacitor App 20150130024 - Song; Young Kyu ; et al.	2015-05-14
Solonoid Inductor In A Substrate App 20150130021 - Kim; Daeik Daniel ; et al.	2015-05-14
Embedded Layered Inductor App 20150124418 - Song; Young Kyu ; et al.	2015-05-07
Toroid Inductor In An Integrated Device App 20150115403 - Song; Young Kyu ; et al.	2015-04-30
Stiffener With Embedded Passive Components App 20150091132 - KIM; Dong Wook ; et al.	2015-04-02
Connector Placement For A Substrate Integrated With A Toroidal Inductor App 20150092314 - Kim; Daeik Daniel ; et al.	2015-04-02
Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages Grant 8,987,872 - Hwang , et al. March 24, 2	2015-03-24
Integrated Passive Device (ipd) On Subtrate App 20150048480 - Kim; Daeik Daniel ; et al.	2015-02-19
High Quality Factor Filter Implemented In Wafer Level Packaging (wlp) Integrated Device App 20140319652 - Lee; Jong-Hoon ; et al.	2014-10-30
Bandpass Filter Implementation On A Single Layer Using Spiral Capacitors App 20140266508 - Song; Young Kyu ; et al.	2014-09-18
Electromagnetic Interference Enclosure For Radio Frequency Multi-chip Integrated Circuit Packages App 20140252568 - Hwang; Kyu-Pyung ; et al.	2014-09-11
Metal Graphic And Method To Produce A Metal Graphic App 20130177778 - Song; Young-Kyu ; et al.	2013-07-11
Wire bonder for ball bonding insulated wire and method of using same Grant 7,360,675 - Persic , et al. April 22, 2	2008-04-22
Wire Bonding Process For Insulated Wires App 20070262119 - Ramkumar; Malliah ; et al.	2007-11-15
Wire bonder for ball bonding insulated wire and method of using same App 20050139637 - Persic, John I. ; et al.	2005-06-30
Wire bonder for ball bonding insulated wire and method of using same Grant 6,896,170 - Lyn , et al. May 24, 2	2005-05-24
Wire bonder for ball bonding insulated wire and method of using same App 20030234275 - Lyn, Robert J. ; et al.	2003-12-25

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