Song; Young Ah

Patent Applications and Registrations

Patent applications and USPTO patent grants for Song; Young Ah.The latest application filed is for "multi-layer ceramic electronic component and manufacturing method thereof".

Company Profile

0.3.11

Song; Young Ah - Suwon-si KR
Song; Young Ah - Gyeonggi-do KR
Song; Young Ah - Gyunggi-do KR
SONG; Young Ah - Suwon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-layer ceramic electronic component and manufacturing method thereof Grant 11,222,751 - Song , et al. January 11, 2	2022-01-11
Multi-layer Ceramic Electronic Component And Manufacturing Method Thereof App 20210183576 - Song; Young Ah ; et al.	2021-06-17
Copper Nano Paste, Method For Forming The Copper Nano Paste, And Method For Forming Electrode Using The Copper Nano Paste App 20120220072 - KIM; Dong Hoon ; et al.	2012-08-30
Method of forming metal wiring and metal wiring formed using the same Grant 8,216,635 - Song , et al. July 10, 2	2012-07-10
Thin Metal Film Electrode And Fabricating Method Thereof App 20120168201 - SONG; Young Ah ; et al.	2012-07-05
Reducing agent for low temperature reducing and sintering of copper nanoparticles Grant 8,206,609 - Kim , et al. June 26, 2	2012-06-26
Solar Cell And Method Of Manufacturing The Same App 20120111401 - KANG; Sung Koo ; et al.	2012-05-10
Method Of Forming Metal Wiring And Metal Wiring Formed Using The Same App 20100196681 - SONG; Young Ah ; et al.	2010-08-05
Method For Treating Surface Of Substrate Resin And Substrate Resin Treated Thereby App 20100068467 - SONG; Young-Ah ; et al.	2010-03-18
Method Of Manufacturing Printed Circuit Board App 20100058585 - Remizov; Sergey ; et al.	2010-03-11
Printed Circuit Board And Manufacturing Method App 20100059251 - REMIZOV; Sergey ; et al.	2010-03-11
Reducing Agent For Low Temperature Reducing And Sintering Of Copper Nanoparticles, And Method For Low Temperature Sintering Using The Same App 20100055302 - KIM; In-Young ; et al.	2010-03-04
Method Of Forming Printed Circuit Pattern, Forming Guide For Pattern, And Guide-forming Ink App 20090286004 - OH; Sung-Il ; et al.	2009-11-19
Method for manufacturing printed circuit board App 20090136874 - KIM; In-Young ; et al.	2009-05-28

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.