Song; Won-sang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Song; Won-sang.The latest application filed is for "interconnections having double capping layer and method for forming the same".

Company Profile

0.12.11

Song; Won-sang - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnections having double capping layer and method for forming the same Grant 7,951,712 - Lee , et al. May 31, 2	2011-05-31
Interconnections Having Double Capping Layer and Method for Forming the Same App 20100003814 - Lee; Kyoung-woo ; et al.	2010-01-07
Interconnections having double capping layer and method for forming the same Grant 7,605,472 - Lee , et al. October 20, 2	2009-10-20
Interconnections having double capping layer and method for forming the same App 20070138642 - Lee; Kyoung-woo ; et al.	2007-06-21
Interconnections having double capping layer and method for forming the same Grant 7,205,666 - Lee , et al. April 17, 2	2007-04-17
Interconnections having double capping layer and method for forming the same App 20060163736 - Lee; Kyoung-woo ; et al.	2006-07-27
Interconnections having double capping layer and method for forming the same Grant 7,037,835 - Lee , et al. May 2, 2	2006-05-02
Methods for fabricating field effect transistors having elevated source/drain regions Grant 6,881,630 - Song , et al. April 19, 2	2005-04-19
Apparatus for testing reliability of interconnection in integrated circuit Grant 6,842,028 - Song , et al. January 11, 2	2005-01-11
Apparatus for testing reliability of interconnection in integrated circuit App 20040189338 - Song, Won-Sang ; et al.	2004-09-30
Interconnections having double capping layer and method for forming the same App 20040135261 - Lee, Kyoung-woo ; et al.	2004-07-15
Semiconductor device having a metal silicide layer and method for manufacturing the same Grant 6,740,587 - Song , et al. May 25, 2	2004-05-25
Apparatus for testing reliability of interconnection in integrated circuit Grant 6,693,446 - Song , et al. February 17, 2	2004-02-17
Apparatus for testing reliability of interconnection in integrated circuit Grant 6,690,187 - Song , et al. February 10, 2	2004-02-10
Method of fabricating a semiconductor device using trench isolation method including hydrogen annealing step Grant 6,645,866 - Park , et al. November 11, 2	2003-11-11
Methods for fabricating field effect transistors having elevated source/drain regions App 20030197224 - Song, Won-sang ; et al.	2003-10-23
Field effect transistors having elevated source/drain regions Grant 6,580,134 - Song , et al. June 17, 2	2003-06-17
Method of fabricating a semiconductor device using trench isolation method including hydrogen annealing step App 20030104677 - Park, Tai-Su ; et al.	2003-06-05
Apparatus for testing reliability of interconnection in integrated circuit App 20030020497 - Song, Won-Sang ; et al.	2003-01-30
Apparatus for testing reliability of interconnection in integrated circuit App 20030020507 - Song, Won-Sang ; et al.	2003-01-30
Method of fabricating a semiconductor device using trench isolation method including hydrogen annealing step Grant 6,511,888 - Park , et al. January 28, 2	2003-01-28
Semiconductor device having a metal silicide layer and method for manufacturing the same App 20020036353 - Song, Won-Sang ; et al.	2002-03-28
Method of manufacturing metal pattern of semiconductor device App 20020001945 - Song, Won-Sang ; et al.	2002-01-03

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