Song; Keng Yew James
Patent Applications and Registrations
Patent applications and USPTO patent grants for Song; Keng Yew James.The latest application filed is for "apparatus for increasing coverage of shielding gas during wire bonding".
- Song; Keng Yew James - Singapore N/A SG
| Patent | Date |
|---|---|
| Bonding machine incorporating dual-track transfer mechanism Grant 8,707,550 - Song , et al. April 29, 2 | 2014-04-29 |
| Automatic wire feeding method for wire bonders Grant 8,459,530 - Zhang , et al. June 11, 2 | 2013-06-11 |
| Apparatus For Increasing Coverage Of Shielding Gas During Wire Bonding App 20120145770 - SONG; Keng Yew James ; et al. | 2012-06-14 |
| Wire Feeding Apparatus For Wire Bonders App 20120132695 - ZHANG; Yue ; et al. | 2012-05-31 |
| Apparatus for increasing coverage of shielding gas during wire bonding Grant 8,186,562 - Song , et al. May 29, 2 | 2012-05-29 |
| Automatic Wire Feeding System For Wire Bonders App 20110101073 - ZHANG; Yue ; et al. | 2011-05-05 |
| Bonding Machine Incorporating Dual-track Transfer Mechanism App 20110016707 - SONG; Keng Yew James ; et al. | 2011-01-27 |
| Electronic device handler for a bonding apparatus Grant 7,677,431 - Wong , et al. March 16, 2 | 2010-03-16 |
| Electronic device handler for a bonding apparatus Grant 7,568,606 - Wong , et al. August 4, 2 | 2009-08-04 |
| Electronic Device Handler For A Bonding Apparatus App 20080092370 - WONG; Yam Mo ; et al. | 2008-04-24 |
| Electronic Device Handler For A Bonding Apparatus App 20080093004 - WONG; Yam Mo ; et al. | 2008-04-24 |
| Movable Electronic Flame-off Device For A Bonding Apparatus App 20080073408 - KWAN; Ka Shing Kenny ; et al. | 2008-03-27 |
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