Song; Keng Yew
Patent Applications and Registrations
Patent applications and USPTO patent grants for Song; Keng Yew.The latest application filed is for "automated particle removal system having angular adjustability".
- Song; Keng Yew - Singapore SG
| Patent | Date |
|---|---|
| Automated particle removal system having angular adjustability Grant 11,400,495 - Song , et al. August 2, 2 | 2022-08-02 |
| Multiple actuator wire bonding apparatus Grant 11,289,446 - Song , et al. March 29, 2 | 2022-03-29 |
| Automated Particle Removal System Having Angular Adjustability App 20220073286 - SONG; Keng Yew ; et al. | 2022-03-10 |
| Wire bonding apparatus threading system Grant 11,239,197 - Song , et al. February 1, 2 | 2022-02-01 |
| Apparatus and method for processing a semiconductor device Grant 11,227,779 - Ding , et al. January 18, 2 | 2022-01-18 |
| Driving system having reduced vibration transmission Grant 11,205,937 - Song , et al. December 21, 2 | 2021-12-21 |
| Bonding apparatus with replaceable bonding tool Grant 11,205,634 - Song , et al. December 21, 2 | 2021-12-21 |
| Formation of bonding wire vertical interconnects Grant 11,145,620 - Goh , et al. October 12, 2 | 2021-10-12 |
| Wire Bonding Apparatus Threading System App 20210159205 - SONG; Keng Yew ; et al. | 2021-05-27 |
| Automated particle removal system Grant 11,017,996 - Shu , et al. May 25, 2 | 2021-05-25 |
| Method For Measuring The Heights Of Wire Interconnections App 20200348243 - SONG; Keng Yew ; et al. | 2020-11-05 |
| Automated Particle Removal System App 20200321211 - SHU; Gang ; et al. | 2020-10-08 |
| Formation Of Bonding Wire Vertical Interconnects App 20200286855 - GOH; Mow Huat ; et al. | 2020-09-10 |
| Driving System Having Reduced Vibration Transmission App 20200028407 - SONG; Keng Yew ; et al. | 2020-01-23 |
| Bonding Apparatus With Replaceable Bonding Tool App 20200020661 - SONG; Keng Yew ; et al. | 2020-01-16 |
| Multiple Actuator Wire Bonding Apparatus App 20190304947 - SONG; Keng Yew ; et al. | 2019-10-03 |
| Apparatus And Method For Processing A Semiconductor Device App 20190080939 - DING; Jiapei ; et al. | 2019-03-14 |
| Method and apparatus for measuring a free air ball size during wire bonding Grant 10,163,845 - Song , et al. Dec | 2018-12-25 |
| Method and system for pull testing of wire bonds Grant 9,889,521 - Song , et al. February 13, 2 | 2018-02-13 |
| Method of forming three-dimensional wire loops and wire loops formed using the method Grant 9,881,891 - Grijaldo , et al. January 30, 2 | 2018-01-30 |
| Wire bonding apparatus comprising an oscillator mechanism Grant 9,640,512 - Song , et al. May 2, 2 | 2017-05-02 |
| Wire bonder and method of calibrating a wire bonder Grant 9,620,477 - Song , et al. April 11, 2 | 2017-04-11 |
| Automatic wire tail adjustment system for wire bonders Grant 9,502,374 - Song , et al. November 22, 2 | 2016-11-22 |
| Method And System For Pull Testing Of Wire Bonds App 20160153880 - SONG; Keng Yew ; et al. | 2016-06-02 |
| Wire Bonding Apparatus Comprising An Oscillator Mechanism App 20160023298 - SONG; Keng Yew ; et al. | 2016-01-28 |
| Method And Apparatus For Measuring A Free Air Ball Size During Wire Bonding App 20150008251 - SONG; Keng Yew ; et al. | 2015-01-08 |
| Wire Bonder And Method Of Calibrating A Wire Bonder App 20140209663 - SONG; Keng Yew ; et al. | 2014-07-31 |
| Automatic Wire Tail Adjustment System For Wire Bonders App 20130098877 - SONG; Keng Yew ; et al. | 2013-04-25 |
| Apparatus for detecting the oscillation amplitude of an oscillating object Grant 6,827,247 - Fan , et al. December 7, 2 | 2004-12-07 |
| Multiple-head wire-bonding system Grant 6,749,100 - Wong , et al. June 15, 2 | 2004-06-15 |
| Bonding system Grant 6,572,001 - Wong , et al. June 3, 2 | 2003-06-03 |
| Multiple-head wire-bonding system App 20030098340 - Wong, Yam Mo ; et al. | 2003-05-29 |
| Detection of wire bonding failures App 20020130158 - Boller, Michael Armin ; et al. | 2002-09-19 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 